Hello , i want to have a powerpoint presentation covering this topic, flip chip technology in optic, and as well as the brief theory to understand what is written or bullted in power point slide, this stuff should be at master level

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Flip Chip Packaging



What is Flip Chip?

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PRODUCT INFORMATION.
Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Please send me topic related papers and ppt...
Thank You
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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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DM74LS373/DM74LS374 3-STATE Octal D-Type Transparent Latches and
Edge-Triggered Flip-Flops


General Description

These 8-bit registers feature totem-pole 3-STATE outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. The high-impedance state and increased high-logic level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or ....etc

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PRESENTED BY:
B.Vinod kumar
Z.Vijay kumar
C.V. Karunakar reddy
M.Sreeja
G.Ramesh


objective
In present CMOS circuits the power dissipation caused by leakage current cannot be neglected as the technology scaling down
Here single treshold transmission gate D flip flop is the bench circuit and new transmission gate flip flop based on different techniques are used
Here the techniques like dual threshold and the stacking of MTCMOS transistors is used to reduce the leakage current.
The v ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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