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Title: estimation of age through fingerprints using wavelet transform and singular value decomposition
Page Link: estimation of age through fingerprints using wavelet transform and singular value decomposition -
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Created at: Thursday 20th of November 2014 07:57:42 PM
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Title: vlsi chip makings singular future
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Created at: Sunday 11th of March 2012 02:43:02 PM
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Title: ppt on vlsi chip makings singular future
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: 3d image processing vlsi system with network on chip system and reconfigurable memory architecture ppt
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Title: carbon chip or diamond chip
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Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: diamond chip o carbon chip
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Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: VLSI CHIP MAKINGS SINGULAR FUTURE
Page Link: VLSI CHIP MAKINGS SINGULAR FUTURE -
Posted By: seminar surveyer
Created at: Monday 04th of October 2010 11:40:17 AM
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Prepared by:
G.Naga Sathish
D.Krishna Avinash

ABSTRACT
Since the invention of the integrated circuit in 1958,the number of processing steps required to make one has grown from less than 10 to several hundreds. At the same time, the silicon wafers on which the VLSI ICs are produced have gone from being coin sized to being dinner-plate –sized. Today one of these 300-mm wafers can yield more than 700 Ics.With such a large number of Ics coming from a single wafer and with wafers coming off manufacturing ....etc

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