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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: estimation of age through fingerprints using wavelet transform and singular value decomposition
Page Link: estimation of age through fingerprints using wavelet transform and singular value decomposition -
Posted By:
Created at: Thursday 20th of November 2014 07:57:42 PM
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respected sir,
I am doing project in estimation of age i dont know how to do ,so please give ideas and step by step process to do.
thank you
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Title: 3d image processing vlsi system with network on chip system and reconfigurable memory architecture ppt
Page Link: 3d image processing vlsi system with network on chip system and reconfigurable memory architecture ppt -
Posted By:
Created at: Wednesday 26th of December 2012 02:22:38 PM
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please give ppt of the seminar topic3d image processing vlsi system with network on chip system and reconfigurable memory architecture
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: network on chip using vlsi
Page Link: network on chip using vlsi -
Posted By:
Created at: Saturday 06th of October 2012 12:20:32 AM
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Title: ppt on vlsi chip makings singular future
Page Link: ppt on vlsi chip makings singular future -
Posted By:
Created at: Sunday 11th of March 2012 09:41:54 PM
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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: Development of a feature-rich Employee Transfer Applicationusing c or java
Page Link: Development of a feature-rich Employee Transfer Applicationusing c or java -
Posted By: mechanical engineering crazy
Created at: Wednesday 05th of August 2009 08:04:45 PM
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Develop an Intranet Employee Transfer Application, which will cover the following functionalities: 1) Login a) Employees b) System Administrator 2) Interface for filling up the following information a) Searching the transfer records. b) Updating the transfer records. c) Making new transfers.(this can be combined with the update page by enabling and disabling the update and make transfer buttons.) 3) Interface to generate the transfer related documents in Doc format. 4) Automatic mail notifications to the employees who got transferred and to the ....etc

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Title: vlsi chip makings singular future
Page Link: vlsi chip makings singular future -
Posted By:
Created at: Sunday 11th of March 2012 02:43:02 PM
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Title: VLSI CHIP MAKINGS SINGULAR FUTURE
Page Link: VLSI CHIP MAKINGS SINGULAR FUTURE -
Posted By: seminar surveyer
Created at: Monday 04th of October 2010 11:40:17 AM
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Prepared by:
G.Naga Sathish
D.Krishna Avinash

ABSTRACT
Since the invention of the integrated circuit in 1958,the number of processing steps required to make one has grown from less than 10 to several hundreds. At the same time, the silicon wafers on which the VLSI ICs are produced have gone from being coin sized to being dinner-plate –sized. Today one of these 300-mm wafers can yield more than 700 Ics.With such a large number of Ics coming from a single wafer and with wafers coming off manufacturing ....etc

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