In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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In general , which sdlc should be used for online shopping system ?

please help. ....etc

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i want system development life cycle of online voting ....etc

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Using SDLC Checklists and Reviews to Avert Security Flaws


Do you know?

75% of attacks today happen at the Application (Gartner). Desktop augmented by Network and then Web Application Security.

Many “easy hacking recipes” published on web.

3 out of 4 vendor apps we tested had serious SQL Injection bugs!

“The cost of correcting code in production increases up to 100 times as compared to in development...”
(1) MSDN (November, 2005) � ....etc

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i want the sdlc followed by most of the intrusion detection systems
....etc

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Your Ad Here

i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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1.INTRODUCTION
This document describes the Software Development LifeCycle (SDLC) for small to medium database application development efforts This chapter presents an overview of the SDLC, alternate lifecycle models, and associated references. The following chapter describes the internal processes that are common across all stages of the SDLC, and the third chapter describes the inputs, outputs, and processes of each stage. Finally, the conclusion describes the four core concepts that form the basis of this SDLC.
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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ABSTRACT
STEPS INVOLVED IN SOFTWARE DEVELOPMENT LIFE CYCLE(SDLC)



Preject identification and selection
Project initialisation and planning
Requirement anaysis
Design
Coding
Testing
Implementation
Maintainance


PROJECT IDENTIFICATION AND SELECTION

This identifies the need for a new system or enhance system.
Information need of an organisation as who ....etc

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