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Title: ADVANCED IC PACKAGING TECHNOLOGIES
Page Link: ADVANCED IC PACKAGING TECHNOLOGIES -
Posted By: computer science topics
Created at: Tuesday 29th of June 2010 03:17:19 AM
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ADVANCED IC PACKAGING TECHNOLOGIES
Abstract

ADVANCED IC PACKAGING TECHNOLOGIES The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat ....etc

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Title: ppt on vlsi chip makings singular future
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Created at: Sunday 11th of March 2012 09:41:54 PM
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Title: vlsi chip makings singular future
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Created at: Sunday 11th of March 2012 02:43:02 PM
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Title: carbon chip or diamond chip
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Posted By: sprity
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Title: network on chip using vlsi
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Created at: Saturday 06th of October 2012 12:20:32 AM
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Title: 3d image processing vlsi system with network on chip system and reconfigurable memory architecture ppt
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Created at: Wednesday 26th of December 2012 02:22:38 PM
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Title: Flip Chip Packaging
Page Link: Flip Chip Packaging -
Posted By: seminar addict
Created at: Wednesday 01st of February 2012 03:41:53 PM
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Flip Chip Packaging



What is Flip Chip?

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Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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Title: diamond chip o carbon chip
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Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: VLSI CHIP MAKINGS SINGULAR FUTURE
Page Link: VLSI CHIP MAKINGS SINGULAR FUTURE -
Posted By: seminar surveyer
Created at: Monday 04th of October 2010 11:40:17 AM
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Prepared by:
G.Naga Sathish
D.Krishna Avinash

ABSTRACT
Since the invention of the integrated circuit in 1958,the number of processing steps required to make one has grown from less than 10 to several hundreds. At the same time, the silicon wafers on which the VLSI ICs are produced have gone from being coin sized to being dinner-plate –sized. Today one of these 300-mm wafers can yield more than 700 Ics.With such a large number of Ics coming from a single wafer and with wafers coming off manufacturing ....etc

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Title: Flip chip or Direct Chip Attach DCA
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Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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