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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: flip chip technology full ppt required for seminar
Page Link: flip chip technology full ppt required for seminar -
Posted By:
Created at: Sunday 13th of January 2013 11:17:07 PM
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Title: J K D FLIP FLOPS
Page Link: J K D FLIP FLOPS -
Posted By: seminar class
Created at: Thursday 14th of April 2011 05:55:28 PM
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Presented by
Aiswariya R



JK Flip-flop

• The most versatile of the flip-flops
• Has two data inputs (J and K)
• Do not have an undefined state like SR flip-flops
– When J & K both equal 1 the output toggles on the active clock edge
Characteristics of JK flip-flop
 If one input (J or K) is at logic 0, and the other is at logic 1, then the output is set or reset (by J and K respectively), just like the RS flip-flop, but on the (falling) clock edge.
 If both inputs are 0, then it remains in ....etc

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Title: DM74LS373DM74LS374 3-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip-
Page Link: DM74LS373DM74LS374 3-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip- -
Posted By: project report helper
Created at: Thursday 14th of October 2010 07:45:28 PM
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DM74LS373/DM74LS374 3-STATE Octal D-Type Transparent Latches and
Edge-Triggered Flip-Flops



General Description

These 8-bit registers feature totem-pole 3-STATE outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. The high-impedance state and increased high-logic level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or ....etc

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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: dharitri 5th may page by page newspaper
Page Link: dharitri 5th may page by page newspaper -
Posted By:
Created at: Tuesday 29th of April 2014 04:00:44 AM
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please give me this paper .very required for me . ....etc

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Title: show the page of employment news paper of 42 to 28 dec 2012 page no 43
Page Link: show the page of employment news paper of 42 to 28 dec 2012 page no 43 -
Posted By:
Created at: Thursday 29th of October 2015 10:45:15 PM
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Title: Design of transmission gate D flip flop based on dual threshold technique
Page Link: Design of transmission gate D flip flop based on dual threshold technique -
Posted By: seminar class
Created at: Thursday 07th of April 2011 05:11:49 PM
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PRESENTED BY:
B.Vinod kumar
Z.Vijay kumar
C.V. Karunakar reddy
M.Sreeja
G.Ramesh


objective
In present CMOS circuits the power dissipation caused by leakage current cannot be neglected as the technology scaling down
Here single treshold transmission gate D flip flop is the bench circuit and new transmission gate flip flop based on different techniques are used
Here the techniques like dual threshold and the stacking of MTCMOS transistors is used to reduce the leakage current.
The v ....etc

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Title: design of a low power flip flop using cmos deep submicron technology
Page Link: design of a low power flip flop using cmos deep submicron technology -
Posted By:
Created at: Tuesday 26th of March 2013 05:57:46 PM
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Please send me topic related papers and ppt...
Thank You
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Title: flip chip technology in optics
Page Link: flip chip technology in optics -
Posted By: waqas.ahmed
Created at: Wednesday 22nd of February 2012 06:34:25 AM
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Hello , i want to have a powerpoint presentation covering this topic, flip chip technology in optic, and as well as the brief theory to understand what is written or bullted in power point slide, this stuff should be at master level

regards
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