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Title: DM74LS373DM74LS374 3-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip-
Page Link: DM74LS373DM74LS374 3-STATE Octal D-Type Transparent Latches and Edge-Triggered Flip- -
Posted By: project report helper
Created at: Thursday 14th of October 2010 07:45:28 PM
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DM74LS373/DM74LS374 3-STATE Octal D-Type Transparent Latches and
Edge-Triggered Flip-Flops



General Description

These 8-bit registers feature totem-pole 3-STATE outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. The high-impedance state and increased high-logic level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: Flip chip or Direct Chip Attach DCA
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Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: diamond chip o carbon chip
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Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: Flip Chip Packaging
Page Link: Flip Chip Packaging -
Posted By: seminar addict
Created at: Wednesday 01st of February 2012 03:41:53 PM
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Flip Chip Packaging



What is Flip Chip?

VISIT AMKOR TECHNOLOGY
ONLINE FOR LOCATIONS AND TO
VIEW THE MOST CURRENT
PRODUCT INFORMATION.
Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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Title: flip chip technology in optics
Page Link: flip chip technology in optics -
Posted By: waqas.ahmed
Created at: Wednesday 22nd of February 2012 06:34:25 AM
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Hello , i want to have a powerpoint presentation covering this topic, flip chip technology in optic, and as well as the brief theory to understand what is written or bullted in power point slide, this stuff should be at master level

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Title: fitflop sale Women Birkenstock Arizona Unisex Mocha Suede
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Title: Design of transmission gate D flip flop based on dual threshold technique
Page Link: Design of transmission gate D flip flop based on dual threshold technique -
Posted By: seminar class
Created at: Thursday 07th of April 2011 05:11:49 PM
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PRESENTED BY:
B.Vinod kumar
Z.Vijay kumar
C.V. Karunakar reddy
M.Sreeja
G.Ramesh


objective
In present CMOS circuits the power dissipation caused by leakage current cannot be neglected as the technology scaling down
Here single treshold transmission gate D flip flop is the bench circuit and new transmission gate flip flop based on different techniques are used
Here the techniques like dual threshold and the stacking of MTCMOS transistors is used to reduce the leakage current.
The v ....etc

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Title: flip chip technology full ppt required for seminar
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Posted By:
Created at: Sunday 13th of January 2013 11:17:07 PM
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