In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Name– study of RS flip-flop using NAND gates and NOR gates.
Aim – to study the working of RS flip-flop using NAND gates and NOR gates and compare them.
Apparatus – IC 7400, IC 7402, circuit board, power supply +5V DC, LEDs, connecting wires, soldering iron, cutter etc.
Circuit diagrams


Procedure –
1) You are given IC 7400 and IC 7402. Identify the ICs by reading their numbers and details from above given pin configurations.
2) Connect the gates with their ....etc

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Flip Chip Packaging



What is Flip Chip?

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PRODUCT INFORMATION.
Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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Presented by
Aiswariya R



JK Flip-flop
• The most versatile of the flip-flops
• Has two data inputs (J and K)
• Do not have an undefined state like SR flip-flops
– When J & K both equal 1 the output toggles on the active clock edge
Characteristics of JK flip-flop
 If one input (J or K) is at logic 0, and the other is at logic 1, then the output is set or reset (by J and K respectively), just like the RS flip-flop, but on the (falling) clock edge.
 If both inputs are 0, then it remains in ....etc

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PRESENTED BY:
B.Vinod kumar
Z.Vijay kumar
C.V. Karunakar reddy
M.Sreeja
G.Ramesh


objective
In present CMOS circuits the power dissipation caused by leakage current cannot be neglected as the technology scaling down
Here single treshold transmission gate D flip flop is the bench circuit and new transmission gate flip flop based on different techniques are used
Here the techniques like dual threshold and the stacking of MTCMOS transistors is used to reduce the leakage current.
The v ....etc

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Prepared by:
Khaizuran Abdullah
Zahir M. Hussain


Abstract

Comparative studies on DWT-OFDM and FFTOFDM systems are presented. The model for DWT-OFDM includes zero-padding and vector transpose for transmitting the OFDM signal. MATLAB simulation commands are also described. The discrete wavelet transform-OFDM (DWT-OFDM) has to satisfy the orthonormal bases and the perfect reconstruction properties to be considered as wavelet transform. Different wavelet families have been used and compared with the conventional ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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By
JOSHI G



Abstract

The demand for high-speed mobile wireless communications is rapidly growing.
OFDM technology promises to be a key technique for achieving the high data capacity and spectral efficiency requirements for wireless communication systems of the near future. This work presents an investigation into methods for maximizing the spectral efficiency of Orthogonal Frequency Division Multiplexing (OFDM) systems. The current standards such as IEEE 802.11a in USA and ....etc

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Can anyone please mail me the code for flip ofdm for optics..
Reply to my email id it is [email protected] . My name is pradeep ....etc

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DM74LS373/DM74LS374 3-STATE Octal D-Type Transparent Latches and
Edge-Triggered Flip-Flops


General Description

These 8-bit registers feature totem-pole 3-STATE outputs designed specifically for driving highly-capacitive or relatively low-impedance loads. The high-impedance state and increased high-logic level drive provide these registers with the capability of being connected directly to and driving the bus lines in a bus-organized system without need for interface or ....etc

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