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Title: zinc oxide type lightning arrester wiki
Page Link: zinc oxide type lightning arrester wiki -
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Created at: Sunday 21st of October 2012 06:26:48 PM
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Title: modern trends in power transmission systems wiki
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Created at: Tuesday 09th of October 2012 02:45:48 AM
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Title: electronic communication systems by kennedy ppt wiki
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Created at: Monday 05th of November 2012 06:20:26 AM
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Title: SMS-Wiki
Page Link: SMS-Wiki -
Posted By: seminar class
Created at: Wednesday 11th of May 2011 05:06:22 PM
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Introduction
SMS-Wiki is a non dependent data aggregator. It accumulates and gathers web content on demand - mostly from textual based services such as Wikipedia or online dictionaries. SMS-Wiki refines the content to the core (first 300 relevant words) and produces a clean UTF8 text-output that can be passed to a mobile phone (SMS, MMS), computers (IM, Email, Local Applications) or other communication devices (Via Post/Get, Sockets).
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Title: homomorphic token wiki
Page Link: homomorphic token wiki -
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Created at: Tuesday 16th of October 2012 01:21:16 AM
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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: ppt on anti radiation mobile chip and abstract
Page Link: ppt on anti radiation mobile chip and abstract -
Posted By:
Created at: Friday 04th of April 2014 08:58:24 AM
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Title: automatic car wiper control unit wiki
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Created at: Thursday 25th of October 2012 11:03:03 PM
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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