Passive Millimeter-Wave


Passive millimeter-wave (PMMW) imaging is a method of forming images through the passive detection of naturally occurring millimeter-wave radiation from a scene. Although such imaging has been performed for decades (or more, if one includes microwave radiometric imaging), new sensor technology in the millimeter-wave regime has enabled the generation of PMMW imaging at video rates and has renewed interest in this area. This interest is, in part, driven by the ability to for ....etc

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Definition

Passive millimeter-wave (PMMW) imaging is a method of forming images through the passive detection of naturally occurring millimeter-wave radiation from a scene. Although such imaging has been performed for decades (or more, if one includes microwave radiometric imaging), new sensor technology in the millimeter-wave regime has enabled the generation of PMMW imaging at video rates and has renewed interest in this area. This interest is, in part, driven by the ability to form images during the day or night; in clear weather or in lo ....etc

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1. INTRODUCTION

Passive millimeter-wave (PMMW) imaging is a method of forming images through the passive detection of naturally occurring millimeter-wave radiation from a scene. Although such imaging has been performed for decades (or more, if one includes microwave radiometric imaging), new sensor technology in the millimeter-wave regime has enabled the generation of PMMW imaging at video rates and has renewed interest in this area. This interest is, in part, driven by the ability to ....etc

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Definition
Passive millimeter-wave (PMMW) imaging is a method of forming images through the passive detection of naturally occurring millimeter-wave radiation from a scene. Although such imaging has been performed for decades (or more, if one includes microwave radiometric imaging), new sensor technology in the millimeter-wave regime has enabled the generation of PMMW imaging at video rates and has renewed interest in this area. This interest is, in part, driven by the ability to form images during the day or night; in clear weather or in low- ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Z-WAVES


INTRODUCTION

Z-WAVE AS HOME CONTROL RF PLATFORM

In recent years wireless home control products like light switches, thermostats, blinds/drapes, appliance controls, energy management and access controls have reached the market. In order to have a true mass-market for home controls, it is important to have a low cost technology, which is easy to install and operate. This requires a lightweight system, which, from the end-user or installer point of view, is easy to install ....etc

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Z-Wave

Z-Wave is the interoperable wireless communication standard developed by Danish company Zensys and the Z-Wave Alliance. It is designed for low-power and low-bandwidth appliances, such as home automation and sensor networks Radio specifications Bandwidth: 9,600 bit/s or 40,000 bit/s, fully interoperable Radio specifics In Europe, the 868 MHz band has a 1% duty cycle limitation, meaning that a Z-wave unit can only transmit 1% of the time.

This limitation is not present in the US 908 MHz ban ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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