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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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what system should Brian implement in order tostart changing the human capital ....etc

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Umbilical cord is clamped and cut after delivery. The stump deteriorates through the process of dry gangrene and falls off in 7 to 10 days. After the stump has fallen off, the cord base takes a few more weeks to heal completely.
I ran labs for kids and took them snorkeling, diving, kayaking and hiking, she says. It was fun and easy living on the island, and it was so great to be around the kids' energy and see them introduced to nature. Some of them had never seen underwater life, and it was a great experience..
These also come in var ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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i am satbir saini. i want the full details about the topic brian gate technology .i do not known anything about the topic brian gate technology so i want the full details of the brian gate technology ....etc

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