In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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Abstract—With continued Moore's law scaling, multicore-based architectures are becoming the de facto design paradigm for achieving low-cost and performance/power-efficient processing systems through effective exploitation of available parallelism in software and hardware. A crucial subsystem within multicores is the on-chip interconnection network that orchestrates high-bandwidth, low-latency, and low-power communication of data. Much previous work has focused on improving the design of on-chip networks but without more fully taking into cons ....etc

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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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Qualcomm announced a new wireless chip. The company is calling this chip Gobi, coined from Go and Be, symbolic of travel, expedition and vast coverage, suggesting access anywhere and ultimate mobility. Even if you don't care for the name, the idea should appeal to you. You will be able to purchase a notebook computer with embedded wireless broadband (and a global positioning system, GPS), and no matter where you are in the world (with the exception of Japan, for now), you can turn it on, register on a network and have instant access to wireless ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, bio-medical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outsta ....etc

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