give details about brain chips tecnology ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Hi am lachu i would like to get details on 64 Point FT Chip pdf ..My friend karan said 64 Point FT Chip pdf will be available here and now i am living at kollam and i last studied in the college/school msm college and now am doing dca i need help on this

Hi am lachu i would like to get details on 64 Point FT Chip pdf ..My friend karan said 64 Point FT Chip pdf will be available here and now i am living at kollam and i last studied in the college/school msm college and now am doing dca i need help on this ....etc

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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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plz i need details of diamond chip for my seminars...plz upload if anybody has info
....etc

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hi,
I need ieee paper for chamelon chip. ....etc

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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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Please send me the total seminar report of chip morphing ....etc

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