Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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business innovations through advanced information technology ? ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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hi this is murali. I want to give seminar on bio-chips.so please give me some information on bio-chip.plzz ....etc

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about pdf on deep foundations case histories innovations in design methods and equipment
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presented by:
Omer Tolga Inan


1. Foreword
The Second World War marked the birth of modern day technological warfare; innovations of well-educated scientists and engineers trumped the brute power of well-trained, disciplined troops. Among the most vital of these innovations were those spearheading the advancement of submarine technology in the critical quest for control of the sub-Atlantic: discoveries in very low frequency (VLF) transmission allowed for submarine to submarine, shore to submerged submarine ....etc

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The interface between different fields is believed to be fertile ground for breakthrough research. The interface between the emerging fields of biotechnology and nanotechnology is particularly interesting. The possibilities for new fruit are diverse: biotechnology offers new approaches for self-assembly of structures at the nanoscale, while nanotechnology offers new methods for probing and accessing biological systems. In this talk, I will discuss research in this new frontier in my group, including 1) self-assembly of 2D nanocomponent arrays ....etc

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Recent innovations in loom shedding mechanisms



Introduction

a To whom all the correspondence should be addressed.
Present address: NIFT-TEA College of Knitwear Fashion, Tiruppur 641 606, India
E-mail: [email protected]
During the recent years, considerable research has been done on loom shedding mechanisms. Shedding systems have been suitably modified so that it has now become possible to weave fabrics with varied profiles to suit specific technical applications1-6. Different areas of research h ....etc

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