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Title: conference management system source code in java
Page Link: conference management system source code in java -
Posted By:
Created at: Monday 24th of August 2015 03:18:02 PM
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Title: Conference Management System
Page Link: Conference Management System -
Posted By: seminar addict
Created at: Wednesday 01st of February 2012 02:38:37 PM
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Conference Management System


Introduction
1.1 Purpose

The Conference Management System is designed to manage paper submissions, reviewing and conducting conferences. The main focus of the proposed system is electronic paper submission and reviewing. This system propose to do the program chair(s), the conference organizers, the authors and the reviewers in their respective activities


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Title: conference management system in ooad lab
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Created at: Tuesday 16th of April 2013 04:40:34 PM
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Title: level0 data flow diagram for conference manangement system
Page Link: level0 data flow diagram for conference manangement system -
Posted By: 5fayas
Created at: Sunday 28th of February 2016 01:24:55 PM
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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: source code in java for conference management system
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Created at: Thursday 01st of March 2012 09:58:38 AM
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Title: diamond chip o carbon chip
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Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: Project request ugrent pls srs for conference management system
Page Link: Project request ugrent pls srs for conference management system -
Posted By: durgasainath
Created at: Wednesday 16th of February 2011 06:42:28 AM
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: conference management system project
Page Link: conference management system project -
Posted By:
Created at: Friday 07th of March 2014 02:08:29 AM
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