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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Chemical Mechanical Planarization (CMP) is an important process in semiconductor chip fabrication. In the CMP process, excess material is removed and the surface is planarized by the action of chemical and mechanical forces. Shallow Trench Isolation (STI) has become a key technology for device isolation in recent times. In this method, a shallow trench is made on the silicon wafer between active devices, silicon dioxide is deposited over the trench as well as the active area and the excess silicon dioxide is removed by CMP. The oxide remaining ....etc

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ABSTRACT
In This Seminar An adaptive watermarking capacity analysis in the spatial domain and wavelet domain has to be present. The relationship between the watermarking capacity and the watermark detection error rate is also discussed. The discussion of watermark detection error rate will help us finding the ways to embed more watermark messages while keeping an acceptable detection error rate, it is useful for the design of the general algorithms of watermarking and detection. The watermarking system is analyzed based on the channel capacity ....etc

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Presented by:
Rodger E. Ziemer


3G CDMA - WCDMA and cdma2000
Rules for Efficient Multiple Access
Three laws
 Know the channel
 Minimize interference to others
 Mitigate interference received from others
 Requirements of wireless multiple access
 Channel measurement
 Channel control and modification
 Multiple user channel isolation
Why CDMA?
 Higher capacity
 Improved performance in multipath by diversity
 Lower mobile transmit power = longer battery life
 ....etc

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RATE & DELAY GUARANTEES PROVIDED BY CLOSE PACKET SWITCHES WITH LOAD BALANCING

Abstract: In this paper, we consider an overarching problem that encompasses both performance metrics. In particular, we study the network capacity problem under a given network lifetime requirement. Specifically, for a wireless sensor network where each node is provisioned with an initial energy, if all nodes are required to live up to a certain lifetime criterion, Since the objective of maximizing the sum of rates of all the nodes in the network can lead to a sev ....etc

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Introduction to cdma2000 Standards for Spread
Spectrum Systems


OVERVIEW

The cdma2000 Family of Standards
The cdma2000 family of standards includes core air interface, minimum performance, and
service standards (see 1.3). The cdma2000 air interface standards specify a spread
spectrum radio interface that uses Code Division Multiple Access (CDMA) technology to
meet the requirements for Third Generation (3G) wireless communication systems. The
core air interface standards in the family are [ ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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RATE ALLOCATION & NETWORK LIFETIME PROBLEM FOR WIRELESS SENSOR NETWORKS

Abstract: In this paper, we consider an overarching problem that encompasses both performance metrics. In particular, we study the network capacity problem under a given network lifetime requirement. Specifically, for a wireless sensor network where each node is provisioned with an initial energy, if all nodes are required to live up to a certain lifetime criterion, Since the objective of maximizing the sum of rates of all the nodes in the network can lead to a severe bi ....etc

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CDMA2000 is a technology for the development of cdmaOne/IS-95 to 3rd generation services. Also known as IMT-CDMA Multi-Carrier or IS-2000 is the main route for CDMA operators to second-and-a-half ( 2.5G) and third generation (3G) cellular networks. A set of new standards that define the new air interface and the Radio Access and Core Network changes that will enhance network capacity, improve speed and bandwidth to mobile terminals, and allow end-to-end IP services has been created by the standard-setting body behind CDMA2000 known as 3GPP2. C ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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