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Title: flip chip technology full ppt required for seminar
Page Link: flip chip technology full ppt required for seminar -
Posted By:
Created at: Sunday 13th of January 2013 11:17:07 PM
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Title: innnovative projects on vlsi and embedded systems projects latest 2012 pdf
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Title: Latest reports related to Information Technology field
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Posted By: rakesh.narayanam
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Title: Integrated Implantable Stimulator without Off-Chip Blocking-Capacitors
Page Link: Integrated Implantable Stimulator without Off-Chip Blocking-Capacitors -
Posted By: seminarsonly
Created at: Tuesday 21st of September 2010 03:01:19 PM
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Integrated Implantable Stimulator without Off-Chip Blocking-Capacitors
Presented by:
Shiyad Ashraf
No. 61
College Of Engineering, Trivandrum
2007-11 batch

Contents
Introduction
Working of FES
Need of blocking capacitors
Disadvantages of using blocking capacitors
Methods of protection without off chip capacitors
Technique for avoiding off chip capacitors
Stimulator output stages utilizing blocking capacitors
Current generator circuits
Proposed current generator circuits
Proposed output stage
St ....etc

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Title: latest seminar topics related heat transfer
Page Link: latest seminar topics related heat transfer -
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: ieee paper latest seminars topics related to computer engineering
Page Link: ieee paper latest seminars topics related to computer engineering -
Posted By:
Created at: Sunday 14th of February 2016 10:09:59 PM
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Title: latest in computer integrated manufacturing seminars topics
Page Link: latest in computer integrated manufacturing seminars topics -
Posted By:
Created at: Tuesday 20th of May 2014 08:22:02 PM
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