i need a powerpoint presentation on 64 point fft chip and its abstract ....etc

[:=Read Full Message Here=:]

MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, bio-medical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outsta ....etc

[:=Read Full Message Here=:]

Your Ad Here

i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

[:=Read Full Message Here=:]

Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

[:=Read Full Message Here=:]

Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

[:=Read Full Message Here=:]

MICROMECHANICAL RESONATORS AS TUNERS IN WIRELESS DEVICES
RAJKRISHNAN.R
S7B

OVERVIEW
INTRODUCTION TO MEMS
MEMS RESONATORS
ARCHITECTURE
ADVANTAGES AND DISADVANTAGES
FABRICATION
FUTURE SCOPE AND CONCLUSIONS
REFERENCES




1) INTRODUCTION TO MEMS
The technology of very small mechanical devices driven by electricity.
1 to 100 micrometers in size.
Large surface area to volume ratio of MEMS, surface effects dominate volume effects
MEMS could ....etc

[:=Read Full Message Here=:]

In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

[:=Read Full Message Here=:]

Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for ....etc

[:=Read Full Message Here=:]

please send me seminar ppt for above topic... ....etc

[:=Read Full Message Here=:]

ABSTRACT
Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEM ....etc

[:=Read Full Message Here=:]