please upload a ppt with full report on CHIP MORPHING
ITS REALLY URGENT.MY SEMINAR IS ON FRIDAY. ....etc

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MEMS technology has enabled us to realize advanced micro devices by using processes similar to VLSI technology. When MEMS devices are combined with other technologies new generation of innovative technology will b created. This will offer outstanding functionality. Such technologies will have wide scale applications in fields ranging from automotive, aerodynamics, hydrodynamics, bio-medical and so forth. The main challenge is to integrate all these potentially non-compatible technologies into a single working microsystem that will offer outsta ....etc

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ABSTRACT
Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEM ....etc

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Wireless Battery Charger Chip for Smart-Card Applications
Presented By:
Franz-Xaver Arbinger, Peter Spies, Günter Rohmer,
Fraunhofer IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany

Abstract “
A chip for inductive battery charging is presented, which needs no external components except an antenna to capture the energy from an electromagnetic field. The integrated system blocks are a front-end to limit and rectify the induced alternating voltage and a charge regulator with three control loops for the current, the vol ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Sir,
I need a complete seminar topic on Diamond chip pdf
so please kinly send these topic. ....etc

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dear sir,
I m dodiya kanji.I want to get seminar on dimond chip.
....etc

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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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