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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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Sir plzz provide ppt on topic bio chips its quite urgent

At s4shivani723@gmail. com

Sir plzz provide ppt on topic biochips
at [email protected] ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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hi this is murali. I want to give seminar on bio-chips.so please give me some information on bio-chip.plzz ....etc

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The interface between different fields is believed to be fertile ground for breakthrough research. The interface between the emerging fields of biotechnology and nanotechnology is particularly interesting. The possibilities for new fruit are diverse: biotechnology offers new approaches for self-assembly of structures at the nanoscale, while nanotechnology offers new methods for probing and accessing biological systems. In this talk, I will discuss research in this new frontier in my group, including 1) self-assembly of 2D nanocomponent arrays ....etc

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This article is presented by:
DHARAM VIR
Master of Technology in Electrical Engineering
YMCA INSTITUTE OF ENGINEERING, FARIDABAD
JULY 2009


Analytical Analysis of Double Implanted MOSFET for High Breakdown & Low Power Dissipation using Graded Profile on 6H-SiC Wafer

Objectives of Thesis:

The main objectives of this work were as follows:
Analysis of Double Implanted MOSFET on 6H SiC wafer using uniform doping profile.
Deter ....etc

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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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