Thread / Post | Tags | ||
Title: Go-Anywhere Chip Page Link: Go-Anywhere Chip - Posted By: computer science crazy Created at: Tuesday 24th of February 2009 04:30:15 AM | chip morping, dimand chip or charbon chip, chip foose mustang, 3d ic chip, application of chamelion chip, vcsel chip, floating wind generators for the generation of power anywhere, | ||
Qualcomm announced a new wireless chip. The company is calling this chip Gobi, coined from Go and Be, symbolic of travel, expedition and vast coverage, suggesting access anywhere and ultimate mobility. Even if you don't care for the name, the idea should appeal to you. You will be able to purchase a notebook computer with embedded wireless broadband (and a global positioning system, GPS), and no matter where you are in the world (with the exception of Japan, for now), you can turn it on, register on a network and have instant access to wireless ....etc | |||
| |||
Title: Micromechanical System For System-On-Chip Connectivity Page Link: Micromechanical System For System-On-Chip Connectivity - Posted By: computer science crazy Created at: Monday 22nd of September 2008 02:13:24 AM | ejection system, ipv6 connectivity no network access, dotsoft connectivity in bsnl, system pokayoki, arm system on chip architecture, bio chip transponder, micromechanical connectivity, | ||
Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc | |||
| |||
Title: greenbee microcontroller based project components Page Link: greenbee microcontroller based project components - Posted By: Created at: Friday 16th of August 2013 04:45:09 PM | the project greenbee, greenbee project pdf, greenbee technologie chip, | ||
abstract,required components for micro controller based green bee environment ....etc | |||
Title: Flip chip or Direct Chip Attach DCA Page Link: Flip chip or Direct Chip Attach DCA - Posted By: Electrical Fan Created at: Saturday 14th of November 2009 07:31:59 PM | dca course syllabus pdf in hindi, vlsi chip packaging technology seminar, dca arrivals, presenation of anti radiation chip, 8155 chip, report on carbon chip, seminar on arm system on chip architecture, | ||
In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc | |||
Title: three dimensional 3-D chip design download Report and ppt Page Link: three dimensional 3-D chip design download Report and ppt - Posted By: computer science crazy Created at: Sunday 22nd of February 2009 02:39:50 AM | ppt biofilter design, is13920 download, |