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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: Micromechanical System For System-On-Chip Connectivity
Page Link: Micromechanical System For System-On-Chip Connectivity -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 02:13:24 AM
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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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Title: design and implementation of incremental encoder based position and velocity measurement chip
Page Link: design and implementation of incremental encoder based position and velocity measurement chip -
Posted By:
Created at: Saturday 21st of September 2013 06:44:50 PM
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I need base paper of Design and implementation of Incremental Encoder based position and velocity measurement chip..plz frwd me...i have to submit 25th of this month ....etc

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Title: Design and Implementation of Data Acquisition System Based on Single-Chip Computer
Page Link: Design and Implementation of Data Acquisition System Based on Single-Chip Computer -
Posted By: seminar class
Created at: Saturday 12th of March 2011 05:59:04 PM
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Design and Implementation of Data Acquisition System Based on Single-Chip Computer
AIM:

The main intention of this project is to design a system, which proposed a scheme to Analyzing and plotting the parameters of different sensors using DSP and acquiring parameters using embedded technology.
PURPOSE:
The purpose of this project is to combine the embedded technology with the Digital Signal Processing technology, utilized the keypad selection system to select the sensing parameter and analyzi ....etc

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Title: Clockless Chip
Page Link: Clockless Chip -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 12:17:15 PM
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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Title: Design and implementation of Digital Camera System on Chip Reference httpwwwsem
Page Link: Design and implementation of Digital Camera System on Chip Reference httpwwwsem -
Posted By: a.l.g.n.aditya
Created at: Thursday 30th of December 2010 03:10:37 AM
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i am aditya studying m.tech in vlsi 1st year in kl university. can please send me the further details of this topic design and implementation of digital camer System on Chip. how it works and logic behind it

....etc

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Title: PROGRAMMABLE SYSTEM ON CHIP IMPLEMENTATION OF 16 BIT SIGMA DELTA MODULATOR
Page Link: PROGRAMMABLE SYSTEM ON CHIP IMPLEMENTATION OF 16 BIT SIGMA DELTA MODULATOR -
Posted By: seminar class
Created at: Thursday 17th of February 2011 12:07:39 PM
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presented by:
Vajoorbi Mohammad


ABSTRACT:
In this we concentrate on sigma delta modulator to produce high resolution with less power consumption and without change in conversion speed. low pass filter is used to get the band pass signal
Driven by the digital circuit technology, the feature size of transistors has shrunk into the sub-100nm range earlier than estimated. The working voltage is decreased as a consequence of the size reduction in order to avoid transistor breakdown. However, the dec ....etc

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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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