In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Respected sir,
my name is akhilnath.g, i'm a bca student ,for my studies i want to do a seminar and my teacher give me the topic carbon chip. but i don't know about carbon chip. coming 30th i want to submit the seminar i need your help...
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faithfully
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Development of the Carbon Fiber Reinforced Carbon-carbon Composite for High Temperature Gas-cooled Reactors
In the present paper. details of the development of the candidate CIC composite are described. In the material development, especially, feasibility of the production. stableness of the supply and cost are much taken into consideration. As the physical properties of the material, high mechanical strength such as tensile and bending, high fracture strain and fracture toughness and low dimensional change by neutron ....etc

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