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Title: carbon chip
Page Link: carbon chip -
Posted By: richu
Created at: Friday 27th of November 2009 12:40:42 AM
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Title: seminar for carbon nanotube based supercapacitor pdf
Page Link: seminar for carbon nanotube based supercapacitor pdf -
Posted By:
Created at: Saturday 19th of January 2013 08:02:29 PM
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Title: DIAMOND OR CARBON CHIP
Page Link: DIAMOND OR CARBON CHIP -
Posted By: sprity
Created at: Tuesday 23rd of February 2010 10:24:10 PM
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Title: ask a seminars report about carbon chip
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Posted By: akhil nath
Created at: Sunday 21st of August 2011 11:39:10 PM
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Title: diamond or carbon chip
Page Link: diamond or carbon chip -
Posted By: sprity
Created at: Thursday 25th of February 2010 09:24:23 PM
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: Development of the Carbon Fiber Reinforced Carbon-carbon Composite for High Temperatu
Page Link: Development of the Carbon Fiber Reinforced Carbon-carbon Composite for High Temperatu -
Posted By: computer science technology
Created at: Friday 29th of January 2010 10:32:56 AM
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Development of the Carbon Fiber Reinforced Carbon-carbon Composite for High Temperature Gas-cooled Reactors
In the present paper. details of the development of the candidate CIC composite are described. In the material development, especially, feasibility of the production. stableness of the supply and cost are much taken into consideration. As the physical properties of the material, high mechanical strength such as tensile and bending, high fracture strain and fracture toughness and low dimensional change by neutron ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: seminar report on carbon nanotubes pdf
Page Link: seminar report on carbon nanotubes pdf -
Posted By:
Created at: Tuesday 19th of April 2016 03:03:19 PM
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