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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: A Design of HDB3 CODEC Based on FPGA
Page Link: A Design of HDB3 CODEC Based on FPGA -
Posted By: projectsofme
Created at: Saturday 27th of November 2010 03:09:44 PM
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A Design of HDB3 CODEC Based on FPGA


ABSTRACT
The basic principles and structure of HDB3 was briefly introduced in this paper, and the shortcomings of the existing HDB3 encoder and decoder was analyzed. Then a new design of HDB3 encoder and decoder based on FPGA was proposed, and the hardware design circuit and software simulation were introduced. The simulation was achieved through the VERILOG-HDL in EP2C35F672C8 chip of CycloneII series in the d ....etc

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Title: hdb3 arduino
Page Link: hdb3 arduino -
Posted By:
Created at: Wednesday 22nd of June 2016 10:24:48 PM
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Communicating by hdb3 Arduino ?
Arduinos want to communicate two ethernet HDB3 coded to send data and recivirlos, you can read them but I have doubts on how to do I can help ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: hdb3 decoder rules
Page Link: hdb3 decoder rules -
Posted By:
Created at: Thursday 14th of March 2013 06:01:14 PM
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give rules for high density bipolar 3 code decoder rules ....etc

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Title: simulink hdb3
Page Link: simulink hdb3 -
Posted By:
Created at: Thursday 01st of March 2018 04:49:32 AM
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Hi am ElMehdi, I would like to get details on simulink hdb3 .. I think that this is not available by default in the simulink tool, I need to do a simulation of a transmission chain that uses a digital entery coded in HDB3 as an information to modulate it and transmit it after that. ....etc

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Title: Clockless Chip
Page Link: Clockless Chip -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 12:17:15 PM
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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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Title: Micromechanical System For System-On-Chip Connectivity
Page Link: Micromechanical System For System-On-Chip Connectivity -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 02:13:24 AM
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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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