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Title: Future evolution of microprocessor from single core to multi core
Page Link: Future evolution of microprocessor from single core to multi core -
Posted By: [email protected]
Created at: Monday 07th of February 2011 03:20:16 PM
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Dusa Sindhoori
B.Tech
Sree Chaitanya College Of Engineering
LMD colony
Karimnagar

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Title: comparative study between eddy current loss in laminated core and embedded core
Page Link: comparative study between eddy current loss in laminated core and embedded core -
Posted By: seminar project explorer
Created at: Sunday 13th of March 2011 04:51:30 PM
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Transformer Basics
An electrical device that transfers energy from one circuit to another purely by magnetic inductive coupling.

Review of transformer losses
No load Loss (Excitation Loss) includes the hysteresis loss and eddy current loss.
excitation loss: energy lost by reversing the magnetic field in the core by the alternating AC.
mechanical loss: bearing friction,brush friction and windage loss

Load Loss (Impedance Loss)
Stray loss: It includes distortion of air-gap flux and also due to the due to non uniform ....etc

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Title: debug probe debugging multiple embedded cores and inter-core transactions in NoC
Page Link: debug probe debugging multiple embedded cores and inter-core transactions in NoC -
Posted By: computer science crazy
Created at: Wednesday 21st of October 2009 11:14:57 PM
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ABSTRACT

Existing SoC debug techniques mainly target bus-based systems. They are not readily applicable to the emerging system that use Network-on-Chip (NoC) as on-chip communication scheme. In this paper, we present the detailed design of a novel debug probe (DP) inserted between the core under debug (CUD) and the NoC. With embedded configurable triggers, delay control and time stamping mechanism, the proposed DP is very effective for inter-core transaction analysis as well as controlling embedded cores' debug processes. Experimental result ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: Open Wireless Architecture - The Core to 4G Mobile Communications
Page Link: Open Wireless Architecture - The Core to 4G Mobile Communications -
Posted By: computer science crazy
Created at: Sunday 20th of September 2009 06:49:40 PM
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Open Wireless Architecture - The Core to 4G Mobile
Communications


Abstract


Mobile communication is continuously one of the
hottest areas that are developing at a booming speed,
with advanced techniques emerging in all the fields of
mobile and wireless communications. Current times
are just the beginning for deploying 3G mobile
communication systems, while research on the next
generation of mobile communications, 4G wireless and
mobile networks begin to pave the way for the future.
This article studies the visions of 4G from ....etc

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Title: Dual-Core Processors
Page Link: Dual-Core Processors -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:08:14 PM
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Computer performance has been driven largely by decreasing the size of the chips while increasing the number of transistors they contain. In accordance with Moore?s law, this has caused chip speed to rise and prices to drop. However transistors can?t shrink forever. As components grow thinner, chip manufactures have struggled to cap power usage and heat generation. Even performances enhancing approaching like running multiple instructions per thread have bottomed out. In response manufactures are building chips with multiple cooler running, mor ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: Differentiated Bandwidth Allocation with TCP Protection in Core Routers
Page Link: Differentiated Bandwidth Allocation with TCP Protection in Core Routers -
Posted By: computer science crazy
Created at: Thursday 17th of September 2009 05:27:00 AM
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Differentiated Bandwidth Allocation with TCP Protection in Core Routers


Abstract

Differentiated Services (DiffServ) networks categorize routers into edge routers and core routers.In core routers, one of the technological challenges is how to implement differentiated bandwidth allocation and TCP protection together with low complexity.We present an Active Queue Management (AQM) scheme called CHOKeW. A method is borrowed from a previous scheme, CHOKe, which draws a packet at random from the buffer, compares it with the arriving packet, a ....etc

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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: Dual Core Processor
Page Link: Dual Core Processor -
Posted By: computer science crazy
Created at: Tuesday 23rd of September 2008 03:51:38 AM
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Definition

Seeing the technical difficulties in cranking higher clock speed out of the present single core processors, dual core architecture has started to establish itself as the answer to the development of future processors. With the release of AMD dual core opteron and Intel Pentium Extreme edition 840, the month of April 2005 officially marks the beginning of dual core endeavors for both companies.

The transition from a single core to dual core architecture was triggered by a couple of factors. According to Moore's Law, the number o ....etc

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