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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: clockless chip abstract
Page Link: clockless chip abstract -
Posted By:
Created at: Thursday 20th of December 2012 01:09:18 AM
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Title: Chip Morphing Technology
Page Link: Chip Morphing Technology -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:59:34 PM
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the technology is part of a built-in self-repair system that constantly monitors a chipâ„¢s functionality. eFUSE works by combining software algorithms and microscopic electrical fuses, opposed to laser fuses, to produce chips that can regulate and adapt their own actions in response to changing conditions and system demands ....etc

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Title: chip morphing technology abstract
Page Link: chip morphing technology abstract -
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Created at: Monday 01st of October 2012 10:32:04 AM
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: ppt on anti radiation mobile chip and abstract
Page Link: ppt on anti radiation mobile chip and abstract -
Posted By:
Created at: Friday 04th of April 2014 08:58:24 AM
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: anti radiation chip abstract
Page Link: anti radiation chip abstract -
Posted By:
Created at: Friday 07th of March 2014 06:38:36 AM
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Title: CHIP MORPHING TECHNOLOGY
Page Link: CHIP MORPHING TECHNOLOGY -
Posted By: BHAGYASHRI
Created at: Friday 16th of July 2010 05:37:43 PM
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