Role of packaging material on Pharmaceutical product stability
What is packaging ?
Packaging is defined as the collection
of different components which surround
the pharmaceutical product from the time
of production until its use
Importance of packaging
• Protect against all adverse external influences
that can alter the properties of the product.
• Protect against biological contamination.
• Protect against physical damage.
• Carry the correct information and identification
of the product.
• Tamper evident / Child ....etc

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2. Is the cashew packaging market attractive enough?
3.What are the stakes of different stakeholders in
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4.What should be the marketing strategy for our new
pack ? ....etc

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RELIABILITY IN MEMS PACKAGING


ABSTRACT
Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems. While packaging contributes to the effective production cost of MEMS devices, reliability addresses consumer’s confidence in and expectation on sustainable performance of the products. There are a number of factors that contribute to the reliability of MEMS; packaging, in ....etc

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ADVANCED IC PACKAGING TECHNOLOGIES
Abstract

ADVANCED IC PACKAGING TECHNOLOGIES The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat ....etc

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Flip Chip Packaging



What is Flip Chip?

VISIT AMKOR TECHNOLOGY
ONLINE FOR LOCATIONS AND TO
VIEW THE MOST CURRENT
PRODUCT INFORMATION.
Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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