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Title: dsp viva questions and answers for labs in ou
Page Link: dsp viva questions and answers for labs in ou -
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Created at: Sunday 30th of September 2012 10:55:24 PM
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Title: ADVANCED IC PACKAGING TECHNOLOGIES
Page Link: ADVANCED IC PACKAGING TECHNOLOGIES -
Posted By: computer science topics
Created at: Tuesday 29th of June 2010 03:17:19 AM
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ADVANCED IC PACKAGING TECHNOLOGIES
Abstract

ADVANCED IC PACKAGING TECHNOLOGIES The many different functions of semiconductor devices are made possible by integrated circuits, which are built into the surface of a silicon chip (bear chip) using a complex process. If these chips could be used in unmodified form, packaging would be unnecessary, and the cost of chips reduced. However, because silicon chips are very delicate, even a tiny speck of dust or drop of water can hinder their function. Light can also cause malfunctions. To combat ....etc

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Title: INTEGRATING KEIL 8051 TOOLS INTO THE SILICON LABS IDE
Page Link: INTEGRATING KEIL 8051 TOOLS INTO THE SILICON LABS IDE -
Posted By: project report helper
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INTEGRATING KEIL 8051 TOOLS INTO THE SILICON LABS IDE

Introduction



This application note describes how to integrate the
Keil 8051 Tools into the Silicon Labs IDE
(Integrated Development Environment). It applies
to Version 1.4 of the Silicon Labs IDE. Integrating
Keil 8051 Tools into the Silicon Labs IDE provides
an efficient development environment with
compose, edit, build, download and debug
operations integrated into the same program.
Key Points
• The Intel OMF-51 absolute object file g ....etc

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Title: RELIABILITY IN MEMS PACKAGING
Page Link: RELIABILITY IN MEMS PACKAGING -
Posted By: projectsofme
Created at: Wednesday 13th of October 2010 12:23:50 PM
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RELIABILITY IN MEMS PACKAGING


ABSTRACT
Cost effective packaging and robust reliability are two critical factors for successful commercialization of MEMS and microsystems. While packaging contributes to the effective production cost of MEMS devices, reliability addresses consumer’s confidence in and expectation on sustainable performance of the products. There are a number of factors that contribute to the reliability of MEMS; packaging, in ....etc

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Title: Role of packaging material on Pharmaceutical product stability
Page Link: Role of packaging material on Pharmaceutical product stability -
Posted By: seminar class
Created at: Friday 18th of February 2011 05:40:41 PM
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Role of packaging material on Pharmaceutical product stability
What is packaging ?

Packaging is defined as the collection
of different components which surround
the pharmaceutical product from the time
of production until its use
Importance of packaging
• Protect against all adverse external influences
that can alter the properties of the product.
• Protect against biological contamination.
• Protect against physical damage.
• Carry the correct information and identification
of the product.
• Tamper evident / Child ....etc

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Title: Role of packaging materials on pharmacetical product stability
Page Link: Role of packaging materials on pharmacetical product stability -
Posted By: Dumebi
Created at: Friday 13th of January 2012 04:42:58 PM
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Title: labs of wireless sensor network on opnet
Page Link: labs of wireless sensor network on opnet -
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Created at: Saturday 27th of April 2013 02:03:28 AM
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Title: tci packaging division case study solution
Page Link: tci packaging division case study solution -
Posted By:
Created at: Tuesday 16th of October 2012 02:42:09 AM
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1.What are the problems faced by the cashew industry
regarding packaging of cashews for exports?
2. Is the cashew packaging market attractive enough?
3.What are the stakes of different stakeholders in
cashew packaging?
4.What should be the marketing strategy for our new
pack ? ....etc

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Title: Flip Chip Packaging
Page Link: Flip Chip Packaging -
Posted By: seminar addict
Created at: Wednesday 01st of February 2012 03:41:53 PM
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Flip Chip Packaging



What is Flip Chip?

VISIT AMKOR TECHNOLOGY
ONLINE FOR LOCATIONS AND TO
VIEW THE MOST CURRENT
PRODUCT INFORMATION.
Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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Title: LABS GURU
Page Link: LABS GURU -
Posted By: seminar addict
Created at: Monday 30th of January 2012 06:57:49 PM
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LABS GURU



Introduction
Now a days DC motor plays a vital role in most of the industrial areas, it can be seen in most of the
electronic devices. They are mainly used for the mechanical movements of physical applications
such as rolling the bundle of sheets or CD drives, lifts etc.
Many methods evolved to control the revolution of a motor. DC motors can be controlled either
by software or directly by hardware. Software controlling needs computers which a ....etc

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