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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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i wanted the seminar report on chip morphing... ....etc

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i need a powerpoint presentation on 64 point fft chip and its abstract ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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plz send me ppt on diamond chip, r abstract, r pdf for it ....etc

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hai i am Pruthvi, an instrumentation student and i am interested to get details regarding 'DIAMOND CHIPS'.and i would also like to know whether in current scenario the diamond chips can replace the existing silicon chips. ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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pls send me d diamond chip ppt ....etc

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please upload a ppt with full report on CHIP MORPHING
ITS REALLY URGENT.MY SEMINAR IS ON FRIDAY. ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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