plz can u send me ppt on brain chip for my college presentation , i want this seminar report also.. ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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Hi 

I am Avinash a Research and Innovation Professional; would like detials on brain chip Technology ppt ....etc

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give details about brain chips tecnology ....etc

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ABSTRACT:
We have long used mechanical devices to compensate for physical disability, it may bepossible to augmented mental capacity to add memory or carbon-based neural net 'wetware' brains-at apoint in history, when we might be able to imprint the circuitry of the human brain using transistors on asilicon chip? Brain Chip-a direct interface between the biological information processing system of thebrain and neurons system and the artificial information processing system of microprocessors and siliconelectronics. ....etc

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hai frnd.... this is really an awesome one can please mail me this presentation to [email protected].. ....etc

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I want full seminar report on brain chip ....etc

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I WANT PPTS ON ON CHIP BIOMEDICAL IMAGING ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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