In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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ABSTRACT:
We have long used mechanical devices to compensate for physical disability, it may bepossible to augmented mental capacity to add memory or carbon-based neural net 'wetware' brains-at apoint in history, when we might be able to imprint the circuitry of the human brain using transistors on asilicon chip? Brain Chip-a direct interface between the biological information processing system of thebrain and neurons system and the artificial information processing system of microprocessors and siliconelectronics. ....etc

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