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Title: Flip chip or Direct Chip Attach DCA
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Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: Design and implementation of Digital Camera System on Chip Reference httpwwwsem
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Posted By: a.l.g.n.aditya
Created at: Thursday 30th of December 2010 03:10:37 AM
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Title: carbon chip or diamond chip
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Title: design and implementation of incremental encoder based position and velocity measurement chip
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Title: diamond chip o carbon chip
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Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Posted By: tina6547
Created at: Wednesday 13th of April 2011 02:55:30 PM
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Apple menciptakan merek produk ‘i’ yang bisa dikatakan tak berhubungan dengan fungsi dan desain. Pasti Anda bertanya-tanya apa artinya? Simak berikut.

Ketika Apple mengeluarkan debut produk ‘i’ pertamanya, iMac, pendiri dan CEO Apple Steve Jobs mengatakan, “Itu merupakan perkawinan kesenangan internet dan kesederhanaan Macintosh”.

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Title: three dimensional 3-D chip design download Report and ppt
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Posted By: computer science crazy
Created at: Sunday 22nd of February 2009 02:39:50 AM
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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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