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Title: design and implementation of incremental encoder based position and velocity measurement chip
Page Link: design and implementation of incremental encoder based position and velocity measurement chip -
Posted By:
Created at: Saturday 21st of September 2013 06:44:50 PM
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I need base paper of Design and implementation of Incremental Encoder based position and velocity measurement chip..plz frwd me...i have to submit 25th of this month ....etc

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Title: Smart materials and Smart structures
Page Link: Smart materials and Smart structures -
Posted By: computer science crazy
Created at: Wednesday 08th of April 2009 01:35:27 AM
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A new generation of materials called smart materials is changing the way a structural system is going to be designed, built and monitored. Advances in composite materials, instrumentation and sensing technology (fiber-optic sensors) in combination with a new generation of actuator systems based on Piezoelectric ceramics and shape Memory Alloys have made this possible.

Shape memory alloys have found applications in a variety of high performance products, ranging from aircraft hydraulic coupling and electrical connectors to surgical suture anc ....etc

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Title: ieee paper on gi fi technology free dwnload
Page Link: ieee paper on gi fi technology free dwnload -
Posted By:
Created at: Monday 23rd of February 2015 12:16:17 AM
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Title: smart materials and smart structures in civil engineering ppt
Page Link: smart materials and smart structures in civil engineering ppt -
Posted By:
Created at: Saturday 05th of July 2014 07:16:31 PM
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Title: Wireless Battery Charger Chip for Smart-Card Applications full report
Page Link: Wireless Battery Charger Chip for Smart-Card Applications full report -
Posted By: project topics
Created at: Friday 23rd of April 2010 11:48:50 PM
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Wireless Battery Charger Chip for Smart-Card Applications
Presented By:
Franz-Xaver Arbinger, Peter Spies, Günter Rohmer,
Fraunhofer IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany

Abstract “
A chip for inductive battery charging is presented, which needs no external components except an antenna to capture the energy from an electromagnetic field. The integrated system blocks are a front-end to limit and rectify the induced alternating voltage and a charge regulator with three control loops for the current, the vol ....etc

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Title: smart materials and smart structures in civil engineering ppt
Page Link: smart materials and smart structures in civil engineering ppt -
Posted By:
Created at: Tuesday 29th of July 2014 05:16:21 AM
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: OPEN SMART CLASSROOM EXTENSIBLE AND SCALABLE LEARNING SYSTEM IN SMART SPACE
Page Link: OPEN SMART CLASSROOM EXTENSIBLE AND SCALABLE LEARNING SYSTEM IN SMART SPACE -
Posted By: project topics
Created at: Wednesday 27th of April 2011 03:26:29 PM
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Abstract
Real-time interactive virtual classroom with teleeducation experience is an important approach in distance learning. However, most current systems fail to meet new challenges in extensibility and scalability, which mainly lie with three issues. First, an open system architecture is required to better support the integration of increasing human-computer interfaces and personal mobile devices in the classroom. Second, the learning system should facilitate opening its interfaces, which will help easy deployment that copes with dif ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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i want full report on carbon chip or diamond chip
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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