i want intelligent structures in civil engineering ....etc

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A new generation of materials called smart materials is changing the way a structural system is going to be designed, built and monitored. Advances in composite materials, instrumentation and sensing technology (fiber-optic sensors) in combination with a new generation of actuator systems based on Piezoelectric ceramics and shape Memory Alloys have made this possible.

Shape memory alloys have found applications in a variety of high performance products, ranging from aircraft hydraulic coupling and electrical connectors to surgical suture anc ....etc

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i want full report on carbon chip or diamond chip
i want full report on carbon chip or diamond chip and ppt ....etc

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I need base paper of Design and implementation of Incremental Encoder based position and velocity measurement chip..plz frwd me...i have to submit 25th of this month ....etc

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Wireless Battery Charger Chip for Smart-Card Applications
Presented By:
Franz-Xaver Arbinger, Peter Spies, Günter Rohmer,
Fraunhofer IIS, Am Wolfsmantel 33, 91058 Erlangen, Germany

Abstract “
A chip for inductive battery charging is presented, which needs no external components except an antenna to capture the energy from an electromagnetic field. The integrated system blocks are a front-end to limit and rectify the induced alternating voltage and a charge regulator with three control loops for the current, the vol ....etc

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hi, please send send me the ppt on gi-fi technology. ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Abstract
Real-time interactive virtual classroom with teleeducation experience is an important approach in distance learning. However, most current systems fail to meet new challenges in extensibility and scalability, which mainly lie with three issues. First, an open system architecture is required to better support the integration of increasing human-computer interfaces and personal mobile devices in the classroom. Second, the learning system should facilitate opening its interfaces, which will help easy deployment that copes with dif ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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CAN I KINDLY HAVE THE PPT ABOUT SMART MATERIALS AND SMART STRUCTURES ....etc

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