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Title: wafer bumping ppt and report
Page Link: wafer bumping ppt and report -
Posted By: h.t venkatesh
Created at: Saturday 25th of February 2012 02:26:04 AM
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Title: wafer biscuit manufacturing process ppt
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Title: 3d solar cells seminars ppt
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Title: Crystalline silicon solar cell
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Posted By: Computer Science Clay
Created at: Monday 26th of January 2009 03:24:35 AM
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Crystalline silicon solar cell manufacturing requires vacuum-based processing tools for many critical steps, from mono- to polycrystalline silicon growth to thin-film depositions on silicon wafers. Manufacturing efficiencies can be optimized by considering cost-of-ownership (CoO) parameters for vacuum subsystems based on dry pumps. Careful attention to vacuum systems can make a significant contribution to reduced costs, ultimately permitting profitable production of solar cells that will encourage widespread market growth.

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Title: wafer bumping
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Posted By: harini
Created at: Wednesday 24th of February 2010 11:17:24 PM
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Title: Seminar on 3- D ICs
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Posted By: computer science crazy
Created at: Sunday 20th of September 2009 06:52:41 PM
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3- D ICs

1

ABSTRACT

The unprecedented growth of the computer and the Information

technology industry is demanding Very Large Scale Integrated (VLSI) circuits

with increasing functionality and performance at minimum cost and power

dissipation. VLSI circuits are being aggressively scaled to meet this Demand,

which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one

single chip (SoC) is becoming increasingly desirable, for which planar ....etc

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Title: VLSI-Very Large Scale Integrated Circuit design report
Page Link: VLSI-Very Large Scale Integrated Circuit design report -
Posted By: computer science topics
Created at: Wednesday 09th of June 2010 03:44:38 PM
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Presented By:
D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786
SRI VB4KATESHWARA ENGINEERING COLLEGE
SURYAPET-508 213. NALGONDA DIST.(A.P)
Accredited by NBA


Abstract:

Since the invention of the integrated circuit in 19S8,the number of processing steps required to make one has grown from Less than 10 to several hundreds. At the same time-, the silicon wafers on which the VLSI ICs. are produced have gone from being coin sized to being dinner-plate sized. ....etc

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Title: extreme ultraviolet lithography full report
Page Link: extreme ultraviolet lithography full report -
Posted By: project reporter
Created at: Monday 01st of February 2010 02:28:17 PM
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1. INTRODUCTION

Silicon has been the heart of the world's technology boom for nearly half a century, but microprocessor manufacturers have all but squeezed the life out of it. The current technology used to make microprocessors will begin to reach its limit around 2006. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create more powerful chips. Many are already looking at extreme-ultraviolet lithography (EUVL) as a way to extend the life of silicon at least un ....etc

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Title: 3d ics
Page Link: 3d ics -
Posted By: computer science crazy
Created at: Monday 28th of December 2009 01:35:52 PM
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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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Title: Silicon on insulator power devices full report
Page Link: Silicon on insulator power devices full report -
Posted By: computer science technology
Created at: Friday 22nd of January 2010 01:37:46 AM
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ABSTRACT
This paper provides an introduction to silicon-on-insulator (SOI) technology and the operating principles of high-voltage SOI devices, reviews the performance of the available SOI switching devices in comparison with standard silicon devices, discusses the reasoning behind the use of SOI technology in power applications and covers the most advanced novel power SOI devices proposed to date. The impact of SOI technology on power integrated circuits (PICs) and the problems associated with the integration of high-voltag ....etc

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Title: extreme ultraviolet lithography
Page Link: extreme ultraviolet lithography -
Posted By: mechanical engineering
Created at: Monday 28th of December 2009 07:35:35 PM
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ABSTRACT

Silicon has been the heart of the world's technology boom for nearly half a century. Each year, manufacturers bring out the next great computer chip that boosts computing power and allows our Personal Computers to do more than we imagined just a decade ago. The current technology used to make microprocessors, deep ultraviolet lithography will begin to reach its limit around 2005. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create ....etc

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Title: Introduction to MEMS
Page Link: Introduction to MEMS -
Posted By: summer project pal
Created at: Friday 14th of January 2011 10:47:00 PM
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1. INTRODUCTION
1.1 Micro Electro-Mechanical System (MEMS)
Micro electro-mechanical structures and systems are miniature devices that enable the operation of complex systems. They exist today in many environments, especially automotive, medical, consumer, industrial, and aerospace. Their potential for future penetration into a broad range of applications is real, supported by strong developmental activities at many companies and institutions. The technology consists of a large portfolio of design and fabrication p ....etc

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Title: Check Valves Wafer Wafer-Lug and Double Flanged Type
Page Link: Check Valves Wafer Wafer-Lug and Double Flanged Type -
Posted By: computer girl
Created at: Monday 11th of June 2012 03:48:00 PM
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Check Valves: Wafer, Wafer-Lug, and Double Flanged Type


General

SCOPE
This standard covers design, material, face-to-face dimensions,
pressure-temperature ratings, and examination, inspection,
and test requirements for gray iron, ductile iron, steel,
and alloy single and dual plate check valves. Valve configurations
include wafer, wafer-lug, and double flanged type with
facings that will permit installation between ASME and MSS
flanges that conform to the standards and specifications listed
....etc

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Title: wafer bumping
Page Link: wafer bumping -
Posted By: kamalesh verma
Created at: Tuesday 23rd of March 2010 01:25:41 AM
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Title: Optical Computer Full Seminar Report Download
Page Link: Optical Computer Full Seminar Report Download -
Posted By: computer science crazy
Created at: Tuesday 07th of April 2009 11:24:14 PM
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ABSTRACT
Computers have become an indispensable part of life. We need computers everywhere, be it for work, research or in any such field. As the use of computers in our day-to-day life increases, the computing resources that we need also go up. For companies like Google and Microsoft, harnessing the resources as and when they need it is not a problem. But when it comes to smaller enterprises, affordability becomes a huge factor. With the huge infrastructure come problems like machines failure, hard driv ....etc

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