i need full report of wafer bumping ....etc

[:=Read Full Message Here=:]

Compound solid state switches such as GaAs MESFETs and PIN diodes are widely used in microwave and millimeter wave integrated circuits (MMICs) for telecommunications applications including signal routing, impedance matching networks, and adjustable gain amplifiers. However, these solid-state switches have a large insertion loss (typically 1 dB) in the on state and poor electrical isolation in the off state. The recent developments of micro-electro-mechanical systems (MEMS) have been continuously providing new and improved paradigms in the field ....etc

[:=Read Full Message Here=:]

ABSTRACT

Silicon has been the heart of the world's technology boom for nearly half a century. Each year, manufacturers bring out the next great computer chip that boosts computing power and allows our Personal Computers to do more than we imagined just a decade ago. The current technology used to make microprocessors, deep ultraviolet lithography will begin to reach its limit around 2005. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create ....etc

[:=Read Full Message Here=:]

i want more informations about water bumping topic ....etc

[:=Read Full Message Here=:]

i needed the ppt and full seminar report for this topic ....etc

[:=Read Full Message Here=:]

93/2015
Maximum:100marks
Time:1hourand15minutes

LAchemicalreactionwilloccurspontaneouslyatconstantpressureandtemperature,ifthefreeenergyis:
(A)Zero
(B)+VE
(C )-VE
(D)Noneofthese

2.Entropyisameasureofthe-----------ofasystem.
(A)Temperaturechangesonly
(B)Disorder
(C )Orderlybehavior
(D)Noneofthese

3.Fundamentalprincipleofrefrigerationisbasedonthe-----------
(A)'Second
(B)Zeroth
(C )First
(D)Third

lawofthermodynamics.
4.Heatingofwaterunderatmosphericpressureisan----------------process.
(A)Isochoric. ....etc

[:=Read Full Message Here=:]

Presented By:
D.Sairam(05631A0433)

D.Satishvarma(05631A0437)

ISTE Membership numbers: 1782 &1786
SRI VB4KATESHWARA ENGINEERING COLLEGE
SURYAPET-508 213. NALGONDA DIST.(A.P)
Accredited by NBA


Abstract:
Since the invention of the integrated circuit in 19S8,the number of processing steps required to make one has grown from Less than 10 to several hundreds. At the same time-, the silicon wafers on which the VLSI ICs. are produced have gone from being coin sized to being dinner-plate sized. ....etc

[:=Read Full Message Here=:]

Check Valves: Wafer, Wafer-Lug, and Double Flanged Type


General

SCOPE
This standard covers design, material, face-to-face dimensions,
pressure-temperature ratings, and examination, inspection,
and test requirements for gray iron, ductile iron, steel,
and alloy single and dual plate check valves. Valve configurations
include wafer, wafer-lug, and double flanged type with
facings that will permit installation between ASME and MSS
flanges that conform to the standards and specifications listed
....etc

[:=Read Full Message Here=:]

ABSTRACT
A surface micro machined capacitive switch has been designed and fabricated on a glass substrate. The switch is constructed of a thin metallic membrane crossing over an electroplated coplanar wave-guide transmission line. The electrostatic actuation is utilized as the switching mechanism. The actuation voltage is around 50V. The switch showed low insertion loss of 0.1 dB at 10 GHz and 0.4 dB at 25 dB, and isolation of 15dB at 20GHz. This device offers a potential application in tel ....etc

[:=Read Full Message Here=:]

date of seminars ....etc

[:=Read Full Message Here=:]

i need full report of wafer bumping ....etc

[:=Read Full Message Here=:]

I need to have a PPT on wafer biscuits making.Tks
Philip Joshua ....etc

[:=Read Full Message Here=:]

3- D ICs

1

ABSTRACT

The unprecedented growth of the computer and the Information

technology industry is demanding Very Large Scale Integrated (VLSI) circuits

with increasing functionality and performance at minimum cost and power

dissipation. VLSI circuits are being aggressively scaled to meet this Demand,

which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one

single chip (SoC) is becoming increasingly desirable, for which planar ....etc

[:=Read Full Message Here=:]

ABSTRACT
Computers have become an indispensable part of life. We need computers everywhere, be it for work, research or in any such field. As the use of computers in our day-to-day life increases, the computing resources that we need also go up. For companies like Google and Microsoft, harnessing the resources as and when they need it is not a problem. But when it comes to smaller enterprises, affordability becomes a huge factor. With the huge infrastructure come problems like machines failure, hard driv ....etc

[:=Read Full Message Here=:]

1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

[:=Read Full Message Here=:]

1. INTRODUCTION

Silicon has been the heart of the world's technology boom for nearly half a century, but microprocessor manufacturers have all but squeezed the life out of it. The current technology used to make microprocessors will begin to reach its limit around 2006. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create more powerful chips. Many are already looking at extreme-ultraviolet lithography (EUVL) as a way to extend the life of silicon at least un ....etc

[:=Read Full Message Here=:]

1. INTRODUCTION
1.1 Micro Electro-Mechanical System (MEMS)
Micro electro-mechanical structures and systems are miniature devices that enable the operation of complex systems. They exist today in many environments, especially automotive, medical, consumer, industrial, and aerospace. Their potential for future penetration into a broad range of applications is real, supported by strong developmental activities at many companies and institutions. The technology consists of a large portfolio of design and fabrication p ....etc

[:=Read Full Message Here=:]

Electrochemistry/Electroplating

Oxidation/Reduction
• Oxidation/Reduction Chemical Reactions
– Electron xfer from one material to another
– Electron xfer results on a current flow
• Wet chemical rxns in IC lab typically do not
involve electron xfer
– BOE etching
– PR stripping
– RCA clean ....etc

[:=Read Full Message Here=:]

Electroplating
The chemical conversion of ions in solution into a solid deposit of metal atoms with the work of a electrical power supply
Amount of Deposition
The number of atoms deposited is proportional to the number of electrons passed through the circuit
- We can determine this by measuring the current
Amount of Deposition (cont.)
Note that these equations assume 100% current efficiency (CE) - that is, assuming that all of the electrons are used for converting metal ions. However, another redu ....etc

[:=Read Full Message Here=:]