Check Valves: Wafer, Wafer-Lug, and Double Flanged Type


General

SCOPE
This standard covers design, material, face-to-face dimensions,
pressure-temperature ratings, and examination, inspection,
and test requirements for gray iron, ductile iron, steel,
and alloy single and dual plate check valves. Valve configurations
include wafer, wafer-lug, and double flanged type with
facings that will permit installation between ASME and MSS
flanges that conform to the standards and specifications listed
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ABSTRACT
Quantum Dots(QDs) are small conductive regions in a semiconductor, containing a number of charge carriers(from one to thousand) that occupy well defined discrete quantum states. They have typical dimensions between nanometers to a few microns .When the space at any side, around a material shrinks to 100Ã…, quantisation of the energy levels at the reduced side will occur. In quantum dots electrons are confined in all directions to a volume in space with dimensions on the order of their de Broglie wave lengt ....etc

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Philip Joshua ....etc

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previous work, recent advances in monolithic microwave integrated circuits and also advantages & disadvantages of MMICs. ....etc

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ABSTRACT

Silicon has been the heart of the world's technology boom for nearly half a century. Each year, manufacturers bring out the next great computer chip that boosts computing power and allows our Personal Computers to do more than we imagined just a decade ago. The current technology used to make microprocessors, deep ultraviolet lithography will begin to reach its limit around 2005. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create ....etc

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ABSTRACT
Computers have become an indispensable part of life. We need computers everywhere, be it for work, research or in any such field. As the use of computers in our day-to-day life increases, the computing resources that we need also go up. For companies like Google and Microsoft, harnessing the resources as and when they need it is not a problem. But when it comes to smaller enterprises, affordability becomes a huge factor. With the huge infrastructure come problems like machines failure, hard driv ....etc

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1. INTRODUCTION
1.1 Micro Electro-Mechanical System (MEMS)
Micro electro-mechanical structures and systems are miniature devices that enable the operation of complex systems. They exist today in many environments, especially automotive, medical, consumer, industrial, and aerospace. Their potential for future penetration into a broad range of applications is real, supported by strong developmental activities at many companies and institutions. The technology consists of a large portfolio of design and fabrication p ....etc

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3- D ICs

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ABSTRACT

The unprecedented growth of the computer and the Information

technology industry is demanding Very Large Scale Integrated (VLSI) circuits

with increasing functionality and performance at minimum cost and power

dissipation. VLSI circuits are being aggressively scaled to meet this Demand,

which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one

single chip (SoC) is becoming increasingly desirable, for which planar ....etc

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1. INTRODUCTION

Silicon has been the heart of the world's technology boom for nearly half a century, but microprocessor manufacturers have all but squeezed the life out of it. The current technology used to make microprocessors will begin to reach its limit around 2006. At that time, chipmakers will have to look to other technologies to cram more transistors onto silicon to create more powerful chips. Many are already looking at extreme-ultraviolet lithography (EUVL) as a way to extend the life of silicon at least un ....etc

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ABSTRACT
Smart pixels, the integration of photodetector arrays and processing electronics on a single semiconductor chip, have been driven by its capability to perform parallel processing of large pixelated images and in real-time reduce a complex image into a manageable stream of signals that can be brought off-chip. In recent years, optical modulators and emitters have been integrated with photodetectors and on-chip electronics. The potential uses for smart pixels are almost as varied as are the designs. They can be used ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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