A HIGH SPEED DISTRIBUTED FIFO SCHEME FOR MANAGING INTERCONNECTS

Abstract:- Interconnect delays are increasingly becoming the dominant source of performance degradation in the nano-meter regime, largely because the wires do not scale as well as the transistors. Scaling trends allow for complete systems to be built on a single chip (SoC), but they require long interconnects for global signals and clock distribution networks. The parasitic of these global interconnects make efficient and high-performance operation difficult. On-chip communicati ....etc

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Sensitive skin is a large-area, flexible array of sensors with data processing capabilities, which can be used to cover the entire surface of a machine or even a part of a human body. Depending on the skin electronics, it endows its carrier with an ability to sense its surroundings via the skinâ„¢s proximity, touch, pressure, temperature, chemical/biological, or other sensors. Sensitive skin devices will make possible the use of unsupervised machines operating in unstructured, unpredictable surroundings among people, among many obstacles, o ....etc

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Sensitive skin is a large-area, flexible array of sensors with data processing capabilities, which can be used to cover the entire surface of a machine or even a part of a human body. Depending on the skin electronics, it endows its carrier with an ability to sense its surroundings via the skinâ„¢s proximity, touch, pressure, temperature, chemical/biological, or other sensors. Sensitive skin devices will make possible the use of unsupervised machines operating in unstructured, unpredictable surroundings among people, among many obstacles, o ....etc

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ABSTRACT

Low-k dielectrics are the very latest path breaking development in the field of Integrated Electronics. It is well on its way replacing the Al / SiO2 interconnects with the help of copper in CMOS fabrication of IC Chips. The CMOS technology has an in-built coupling capacitance which increases the time delay, thereby reducing associated processing speeds. This was compensated by reducing the thickness of the Al / SiO2 interconnects. There is a limit to the reduction in t ....etc

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3- D ICs

1

ABSTRACT

The unprecedented growth of the computer and the Information

technology industry is demanding Very Large Scale Integrated (VLSI) circuits

with increasing functionality and performance at minimum cost and power

dissipation. VLSI circuits are being aggressively scaled to meet this Demand,

which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one

single chip (SoC) is becoming increasingly desirable, for which planar ....etc

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INTROUCTION



The idea of using optical techniques to address the chip-to-chip interconnection problems has been around for a long time. However, it is only in the last few years that technology with a realistic promise of eventual commercial applications has emerged. Progress can be attributed to a shift away from trying to develop custom VSLI techniques with in-built optoelectronic capability, towards developing techniques to allow parallel arrays of separately fabricated optoelectronic devices to be tightly integrated with standard foun ....etc

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ABSTRACT
Smart pixels, the integration of photodetector arrays and processing electronics on a single semiconductor chip, have been driven by its capability to perform parallel processing of large pixelated images and in real-time reduce a complex image into a manageable stream of signals that can be brought off-chip. In recent years, optical modulators and emitters have been integrated with photodetectors and on-chip electronics. The potential uses for smart pixels are almost as varied as are the designs. They can be used ....etc

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SILICON PHOTONICS
ABSTRACT
Silicon Photonics can be defined as the utilization of silicon-based materials for the generation, guide, control and detection of light to communicate over distances. Optical technology suffered from a reputation as an expensive solution, based on high cost of hardware components, as they are typically fabricated using exotic materials that are expensive for manufacturing.
These limitations prompted Intel to research the construction of fibre-optic components from other materials, such as silicon (s ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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ABSTRACT
Miniaturization has been a key contributor to advances in electronic technology. Many electronics applications have serious space considerations that are pressuring manufacturers to reduce component size. Much of the motivation for this Certainly, miniaturization has been made possible mostly through remarkable breakthroughs in reducing the size of active components. But as integrated circuits get smaller and more complex, there is an increasing need to also reduce the space required for the supporting passive comp ....etc

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Mellanox and related companies are now positioned to release InfiniBand as a multifaceted architecture within several market segments. The most notable application area is enterprise class network clusters and Internet data centers. These types of applications require extreme performance with the maximum in fault tolerance and reliability. Other computing system uses include Internet service providers, co-location hosting, and large corporate networks. IBA will also see marketing in the embedded device arena for high-speed routers, switches, an ....etc

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Sensitive skin is a large-area, flexible array of sensors with data processing capabilities, which can be used to cover the entire surface of a machine or even a part of a human body. Depending on the skin electronics, it endows its carrier with an ability to sense its surroundings via the skinâ„¢s proximity, touch, pressure, temperature, chemical/biological, or other sensors. Sensitive skin devices will make possible the use of unsupervised machines operating in unstructured, unpredictable surroundings among people, among many obstacles, o ....etc

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