1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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3- D ICs

1

ABSTRACT

The unprecedented growth of the computer and the Information

technology industry is demanding Very Large Scale Integrated (VLSI) circuits

with increasing functionality and performance at minimum cost and power

dissipation. VLSI circuits are being aggressively scaled to meet this Demand,

which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one

single chip (SoC) is becoming increasingly desirable, for which planar ....etc

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3-D ICs

ABSTRACT

The unprecedented growth of the computer and the Information technology industry is demanding Very Large Scale Integrated (VLSI) circuits with increasing functionality and performance at minimum cost and power dissipation. VLSI circuits are being aggressively scaled to meet this Demand, which in turn has some serious problems for the semiconductor industry.

Additionally heterogeneous integration of different technologies in one single chip (SoC) is becoming increasingly desirable, f ....etc

[:=Read Full Message Here=:]

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. Additionally, heterogeneous integration of d ....etc

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Modeling and Simulation of Single-Event
Effects in Digital Devices and ICs
The modeling and simulation of single-event effects (SEE) in digital devices
and integrated circuits is discussed in this article.The physical modeling of ultra-scaled devices (in the deca-nanometer range) and new device architectures
(Silicon-on-insulator, multiple-gate, nanowire MOSFETs are given special emfhasis. The drift-diffusion, hydrodynamic, Monte-Carlo and the other transport models in the device-level simulation is first described. The effects su ....etc

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