The need for high-performance, low-power, and low-cost systems for network transport and wireless communications is driving silicon technology toward higher speed, higher integration, and more functionality.

Further more, this integration of RF and analog mixed-signal circuits into high-performance digital signal-processing (DSP) systems must be done with minimum cost overhead to be commercially viable.

While some analog and RF designs have been attempted in mainstream digital-only complimentary metal-oxide semiconductor (CMOS) technolo ....etc

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SiGe HBT Technology


I. BANDGAP ENGINEERING IN SILICON
WE LIVE in a silicon world. Greater than 95% of
today’s $200 billion global semiconductor market
uses the semiconductor silicon (Si) to realize a host of integrated
circuits (IC’s) ranging from 233-MHz microprocessors
to 64-Mb dynamic random-access memory (DRAM) chips.
Indeed, it is the very existence of Si microelectronics which
has enabled the emergence of the Information Age which
is so profoundly r ....etc

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1. INTRODUCTION
The history of semiconductor devices starts in 1930â„¢s when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share.CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS ....etc

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SiGe HBT Technology: A New Contender



II. SiGe HBT TECHNOLOGY
In order to provide a logical framework for this paper, the
experimental results presented will be largely from IBM’s
SiGe HBT technology . This technology is representative
of the state-of-the-art in 1998, is currently qualified and in
commercial production on 200-mm wafers in an advanced
CMOS fabrication facility, and is thus arguably the most
“real” SiGe HBT technology worldwide. The ....etc

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The history of semiconductor devices starts in 1930?s when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share.CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS covered more than 90% of total MOS scale. In 1983 bipolar compa ....etc

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ABSTRACT
BiCMOS technology is a combination of Bipolar and CMOS technology. CMOS technology offers less power dissipation, smaller noise margins, and higher packing density. Bipolar technology, on the other hand, ensures high switching and I/O speed and good noise performance. It follows that BiCMOS technology accomplishes both - improved speed over CMOS and lower power dissipation than bipolar technology. The main drawback of BiCMOS technology is the higher costs due to the added process complexity. Impurity profiles have ....etc

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BiCMOS Technology

Introduction
The need for high-performance, low-power, and low-cost systems for network transport and wireless communications is driving silicon technology toward higher speed, higher integration, and more functionality.

Further more, this integration of RF and analog mixed-signal circuits into high-performance digital signal-processing (DSP) systems must be done with minimum cost overhead to be commercially viable. While some analog and RF designs have been attempted in mainstream digital-only complimentary metal-oxid ....etc

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Introduction

The history of semiconductor devices starts in 1930's when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share.CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS covered more than 90% of total MOS scale.

In ....etc

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hey bro,
i want information on this topic for giving a seminar on it......
thank you!!!!!! ....etc

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The need for high-performance, low-power, and low-cost systems for network transport and wireless communications is driving silicon technology toward higher speed, higher integration, and more functionality. Further more, this integration of RF and analog mixed-signal circuits into high-performance digital signal-processing (DSP) systems must be done with minimum cost overhead to be commercially viable. While some analog and RF designs have been attempted in mainstream digital-only complimentary metal-oxide semiconductor (C ....etc

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