Abstract
Organic thin-film transistors OTFTs have received considerable attention recently because they can be fabricated at reduced temperature and potentially reduced cost compared to hydrogenated amorphous silicon thin-film transistors. Low fabrication temperature allows a wide range of substrate possibilities and makes OTFTs an attractive technology for many low-cost electronics applications, particularly those that require or may benefit from flexible polymeric substrates such as rf identification tags, smart cards ....etc

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ABSTRACT
In the present world, the display technology is usually analog. But, we present the future technology i.e., the digital technology. The analog display technologies limit the full potential of digital video. So, the digital display devices will be in the market soon. In our paper, we emphasize on Digital Light Processing (DLP). This DLP display technology manipulates the light digitally to produce all-digital images. This technology reproduces color images with precision accuracy in a seamless fashion. The picture ap ....etc

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E-WASTE MANAGEMENT
SEMINAR REPORT
Submitted by
BINDU V.GOPAL
DEPARTMENT OF CIVIL ENGINEERING
COLLEGE OF ENGINEERING TRIVANDRUM


ABSTRACT


The electronic industry is the world’s largest and fastest growing manufacturing industry in the world. Discarded electronic and electrical equipment with all of their peripherals at the end of life is termed e-waste. The quantity of e-waste generated in developed countries equals 1% of total solidwaste on an average and is expected to grow to 2% by 2010 and i ....etc

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Abstract
In this review, the primary FinFET framework is described, along with the reasons behind its release. The production actions are temporarily described. Lastly, some latest perform on FinFETs is provided, along with the excellent problems that individuals have been concentrating on.
Introduction
As gadgets get smaller further and further, the problems with traditional (planar) MOSFETs are improving. Market is currently at the 90nm node (ie. DRAM 50 percent steel message, which matches to checkpoint measures o ....etc

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The history of semiconductor devices starts in 1930?s when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share.CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS covered more than 90% of total MOS scale. In 1983 bipolar compa ....etc

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Polyfuses is a new standard for circuit protection. It is re-settable by itself. Many manufactures also call it as Polyswitch or Multifuse. Polyfuses are not fuses but Polymeric Positive temperature Coefficient Thermistors (PPTC). We can use several circuit protection schemes in 'power supplies to provide protection against fault condition and the resultant and over temperature damage. Current can be accomplished by using resistors, fuses, switches, circuit breakers or positive temperature coefficient devices.Resistors are rarely an acceptable ....etc

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ABSTRACT

The plastic substrates are thinner, lighter, shatterproof, flexible, rollable and foldable, making Silicon-on-Plastic an enabling technology for new applications/products. This paper studies the development of Silicon on Plastic technology. Advances in poly-silicon technology have expanded TFT (THIN FILM TRANSISTORS) technology to high-speed electronics applications such as Smart Cards, RFID tags, portable imaging devices, photo-voltaic devices and solid-state lighting and other integr ....etc

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Poly Fuse

Polyfuse is a new standard for circuit protection. It is resettable. Many manufacturers also call it polyswitch or multifuse. Polyfuses are not fuses but polymeric positive temperature co-efficient (PPTC) thermistors.

Current limiting can be accomplished by using resistors , fuses , switches or positive temperature co-efficient devices. Resistors are rarely an acceptable solution because the high power resistors that are usually required are expensive. One-shot fuses can be used, but they might fatigue, and they must be replaced ....etc

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Mans DJ's NDBs men end jamb DBMS bend Jenn end men men end men men's men's men men's men men's men men's men end jamb DBMS bend Jenn end men end jamb DBMS bend ....etc

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ABSTRACT
BiCMOS technology is a combination of Bipolar and CMOS technology. CMOS technology offers less power dissipation, smaller noise margins, and higher packing density. Bipolar technology, on the other hand, ensures high switching and I/O speed and good noise performance. It follows that BiCMOS technology accomplishes both - improved speed over CMOS and lower power dissipation than bipolar technology. The main drawback of BiCMOS technology is the higher costs due to the added process complexity. Impurity profiles have ....etc

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POLY JET PROCESS

PRESENTED BY
K.SRI RAM VIKAS
V.S.R.KISHORE.B
D.M.S S.VH COLLEGE OF ENGINEERING, Machilipatnam, AP- 521002


Different types of RP methods

The Poly jet process
Stereo lithography (SLA for stereo lithography apparatus),
Selective laser sintering (SLS),
Fused deposition modeling (FDM),
Laminated object manufacturing (LOM),
Inkjet systems and three dimensional printing (3DP).
Solid Ground Curing


Rapid prototyping is a layer -based fabrication that quickly create ....etc

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Silicon photonics can be defined as the utilization of silicon-based materials for the generation (electrical-to-optical conversion), guidance, control, and detection (optical-to-electrical conversion) of light to communicate information over distance.

The most advanced extension of this concept is to have a comprehensive set of optical and electronic functions available to the designer as monolithically integrated building blocks upon a single silicon substrate.


Within the range of fibre optic telecommunication wavelength (1.3 ?m to ....etc

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1. INTRODUCTION
The history of semiconductor devices starts in 1930â„¢s when Lienfed and Heil first proposed the mosfet. However it took 30 years before this idea was applied to functioning devices to be used in practical applications, and up to the late 1980 this trend took a turn when MOS technology caught up and there was a cross over between bipolar and MOS share.CMOS was finding more wide spread use due to its low power dissipation, high packing density and simple design, such that by 1990 CMOS ....etc

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