ABSTRACT
Digital Memory is and has been a close comrade of each and every technical advancement in Information Technology. The current memory technologies have a lot of limitations. These memory technologies when needed to expand will allow expansion only two dimensional space. Hence area required will be increased.
Next Generation Memories satisfy all of the good attributes of memory. The most important one among them is their ability to support expansion in three dimensional spaces. They include MRAM, FeRAM, Polymer Me ....etc

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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wi ....etc

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1. INTRODUCTION
Imagine a time when your mobile will be your virtual assistant and will need far more than the 8k and 16k memory that it has today, or a world where laptops require gigabytes of memory because of the impact of convergence on the very nature of computing. How much space would your laptop need to carry all that memory capacity? Not much, if Intel's project with Thin Film Electronics ASA (TFE) of Sweden works according to plan. TFE's idea is to use polymer memory modules rather than silicon-based memory modules, and what's more it ....etc

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Chapter 1. 1.Introduction
Despite seemingly endless increases in the amount of storage
and ever decreasing costs of hardware, managing storage is
still expensive. Additionally, users continue to fill increasingly
larger disks, worsened by the proliferation of large multimedia
files and high-speed broadband networks. Storage requirements
are continuing to grow at a rate of 50% a year. Worse, existing
hard disk technology is reaching physical limitations, making it
harder and costlier to meet growing user demands .
Sto ....etc

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Can u please help me with interfacing of web cam with 8051 n pc ....etc

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Dynamic resource sharing protection
using label stacking and burst multiplexing
in optical burst switched networks


Abstract: A protection and restoration mechanism is essential to provide reliable traffic transmission in networks, but it is not easy to apply existing protection mechanisms to optical burst-switching (OBS) networks, because of the unique properties of OBS. The authors introduce a 1:1 link-based protection ....etc

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3D Stacking: EDA Challenges & Opportunities



SEMATECH SymposiumTokyo, Japan
Rajiv MaheshwarySenior Director



Summary

3D IC Market Drivers
–Cost, Performance/Power
–Heterogeneous integration
•Customers expected to have production devices starting 2011
–Logic + DRAM and Logic + Logic
–$20B* TSV devices by 2013
•Synopsys Focus
–Enable design flow with partners
–Lead definition of emerging interoperability standards ....etc

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Abstract

Visual cryptography is a popular solution for image encryption. Using secret sharing concepts, the encryption procedure encrypts a secret image into the so-called shares which are noise-like secure images which can be transmitted or distributed over an untrusted communication channel. Using the properties of the human visual system to force the recognition of a secret message from overlapping shares, the secret image is decrypted without additional computations and any knowledge of cryptography.

Visual cryptographic solutions ope ....etc

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Dynamic resource sharing protection
using label stacking and burst multiplexing
in optical burst switched networks


Abstract: A protection and restoration mechanism is essential to provide reliable traffic transmission in networks, but it is not easy to apply existing protection mechanisms to optical burst-switching (OBS) networks, because of the unique properties of OBS. The authors introduce a 1:1 link-based protection ....etc

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Abstract
Organic thin-film transistors OTFTs have received considerable attention recently because they can be fabricated at reduced temperature and potentially reduced cost compared to hydrogenated amorphous silicon thin-film transistors. Low fabrication temperature allows a wide range of substrate possibilities and makes OTFTs an attractive technology for many low-cost electronics applications, particularly those that require or may benefit from flexible polymeric substrates such as rf identification tags, smart cards ....etc

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presented by:
Bidhu Bhushan Panda


QUESTION: -
1. What does RPI’s competitive position appear to be for the entire firm, and for the boating division? What are some of the likely critical success factors for the boating division?
Ans. RPI is known as a very high quality producer with features and prices higher than most in the industry (per the case) which suggest the differentiation strategy. The critical success factors are likely to follow the competitive strategyfocus on quality and innovative featur ....etc

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presented by:
Bidhu Bhushan Panda


QUESTION: -
1. What does RPI’s competitive position appear to be for the entire firm, and for the boating division? What are some of the likely critical success factors for the boating division?
Ans. RPI is known as a very high quality producer with features and prices higher than most in the industry (per the case) which suggest the differentiation strategy. The critical success factors are likely to follow the competitive strategyfocus on quality and innovative featur ....etc

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sir
Please provide me the full report on polyfuse.
Yours faithfully
LEKSHMI S ....etc

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