Respected Sir,

I am pursuing B.tech(ccc) in JNTUH, kukatpally and i am in 4th year. My project is Design of Press Tool for Earthing Lug. For Which i need guidance from you sir.

What materials are used ?
Design principles of press tools?
design of press tool ?
Selection of type of tool?
selection of tool Material?
Design calculation ?
Manufacturing of press tool?
Manufacturing process of press tool?
....etc

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Today we are living in the in the information age. After green revolution and industrial revolution the world is witnessing the Digital Revolution or the Internet revolution. Those days are long gone when internet was beyond the reach of many, today it is fast becoming a part of our lifestyle and more and more people are increasingly using it for a wide variety of purposes. Internet has also emerged as an important medium to reach to the masses. It is one of the most effective means of providing information to a large number of people. The adv ....etc

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I think that this book is really great !
It helped me so much !
Thanks ....etc

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Introduction
There are various software development approaches defined and designed which are used/employed during development process of software, these approaches are also referred as Software Development Process Models.
Each process model follows a particular life cycle in order to ensure success in process of software development.
Computer software has become a driving force. It is the engine that drives business decision making. It serves as the basis for modern scientific investigation ....etc

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Quality tools. Fishbone diagram was proposed by ishikawa .. n he also proposed quality control circlecr ....etc

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full seminar report on machine tools vibration measurements control pd ....etc

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construction details,objectives,advantages, of pamban bridge ....etc

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3D Stacking: EDA Challenges & Opportunities



SEMATECH SymposiumTokyo, Japan
Rajiv MaheshwarySenior Director



Summary

3D IC Market Drivers
–Cost, Performance/Power
–Heterogeneous integration
•Customers expected to have production devices starting 2011
–Logic + DRAM and Logic + Logic
–$20B* TSV devices by 2013
•Synopsys Focus
–Enable design flow with partners
–Lead definition of emerging interoperability standards ....etc

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full seminar report on machine tools vibration measurements control pdf ....etc

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