SUBMITTED BY:
Anshul Singh Sengar
Pankaj Khatri
Shashank Mahajan





THE SUSPENSION SYSTEM

The job of a car suspension is to maximize the friction between the tires and the road surface, to provide steering stability with good handling and to ensure the comfort of the passengers. In this article, we'll explore how car suspensions work, how they've evolved over the years and where the design of suspensions is headed in the future.
If a road were perfectly flat, with no i ....etc

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ABSTRACT
Smart pixels, the integration of photodetector arrays and processing electronics on a single semiconductor chip, have been driven by its capability to perform parallel processing of large pixelated images and in real-time reduce a complex image into a manageable stream of signals that can be brought off-chip. In recent years, optical modulators and emitters have been integrated with photodetectors and on-chip electronics. The potential uses for smart pixels are almost as varied as are the designs. They can be used ....etc

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Flip Chip Packaging



What is Flip Chip?

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Flip Chip (FC) is not a specific package (like SOIC), or even a package type (like BGA). Flip Chip describes the
method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe,
then provides the connection from the die to the exterior of the package. In standard p ....etc

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i need full report of wafer bumping ....etc

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SYNOPSIS
In the present scenario of automobile industry manufacturers are trying to produce comfortable and safe vehicles which the consumers are looking for. A shock absorber is a damping element of the vehicle suspension, and its performance directly affects the comfortability, dynamic load of the wheel and dynamic stroke of the suspension. The conventional type of shock absorbers has got the main drawback that it causes foaming of the fluid at high speeds of operation. This results in a decrease of t ....etc

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F1 Cars

INTRODUCTION
Car racing is one of the most technologically advanced sports in the world today. Race Cars are the most sophisticated vehicles that we see in common use. It features exotic, high-speed, open-wheel cars racing all around the world. The racing teams have to create cars that are flexible enough to run under all conditions. This level of diversity makes a season of F1 car racing incredibly exciting. The teams have to completely revise the aero ....etc

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SPEED BREAKER GENERATOR
INTRODUCTION
“Green” speed bumps that will generate electricity as cars drive over them are to be introduced on Britain’s roads. The hi-tech “sleeping policemen” will power street lights, traffic lights and road signs in a pilot scheme in London that could be rolled out nationwide.
Speed bumps have long been the bane of motorists’ lives, but these will capture the kinetic energy of vehicles.
Peter Hughes, the designer behind the idea, said: “They are speed bumps, but they are ....etc

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Introduction to 3D Graphics Hardware
 Rendering Pipeline
 Graphics are in the Chips
 New developments
 Feature sizes and pipelines
 Transformation and lighting
 Per-pixel effects
 High-definition TV
Graphics are in the Chips
3D Graphics Chips
 Nvidia – GPU(QuadEngine), nfiniteFX Engine
 GeForce256, GeForce2 GTS, GeForce3, GeForce4 Ti
 GeForce Fx
 ATI – Charisma Engine
 Radeon 7000, Radeon 9000, Radeon 9700, Radeon 9800
 Sony – Emotion Engine, Graphics ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Hi there,
I need help with this topic. Does anyone know how to implement this with Matlab...............etc

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I want to know about the Bump check of 500 MW BHEL LP Turbine Rotors and the allowable tolerances also shall be furnished.
Remedial action in the case of not achieving the Bump Check values

B.Varadarajalou
NTPL/Tuticorin..............etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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