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Title: Fundamental Limits Of Silicon Technology
Page Link: Fundamental Limits Of Silicon Technology -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 02:39:49 AM
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The rapid improvement in silicon technology has enables the electronic industry to progress steadily over the past 50 years.

It is this technological stride that make computers to shrink in cost and size .But a question still persists whether the present rate of progress will continue for the next 50 years. The essential ingredient to the progress had been the process of miniaturization.

The road to advances beyond a decade into the future has always been obscure and has stimulated many speculations as to where miniaturization must end. ....etc

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Title: Silicon on insulator technology SOI
Page Link: Silicon on insulator technology SOI -
Posted By: computer science crazy
Created at: Wednesday 21st of October 2009 11:16:37 PM
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Silicon on insulator technology (SOI) refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance and thereby improving performance SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or (less commonly) sapphire. The choice of insulator depends largely on intended application, with sapphire being ....etc

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Title: Z Corporation 3D Printing Technology
Page Link: Z Corporation 3D Printing Technology -
Posted By: projectsofme
Created at: Friday 26th of November 2010 06:44:57 PM
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Z Corporation 3D Printing Technology

Introduction
Originally developed at the Massachusetts Institute of Technology (MIT) in 1993, Three- Dimensional Printing technology (3DP™) forms the basis of Z Corporation’s prototyping process. 3DP technology creates 3D physical prototypes by solidifying layers of deposited powder using a liquid binder. By definition 3DP is an extremely versatile and rapid process accommodating geometry of varying complexity in hundreds of different app ....etc

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Title: DS2 PLC Technology OR Design of Systems on Silicon
Page Link: DS2 PLC Technology OR Design of Systems on Silicon -
Posted By: project report helper
Created at: Thursday 30th of September 2010 12:48:55 PM
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DS2 PLC Technology OR Design of Systems on Silicon


Juan Carlos Riveiro
System Architecture Manager



ABSTRACT

Fabless silicon design house

Mission: to become the leading supplier of IPR (silicon and software) for high speed Powerline Communications (PLC)

Experienced in advanced communications chipsets: QAM, OFDM, FFT, IFFT, FEC, ADCs, DACs, etc.
Incorporated 1998/February/15
Key shareholder: ENDESA (the largest electricity utility in Spain and South America)
Experienced managemen ....etc

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Title: Fundamental Limits Of Silicon Technology
Page Link: Fundamental Limits Of Silicon Technology -
Posted By: computer science crazy
Created at: Sunday 15th of February 2009 03:15:52 PM
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The rapid improvement in silicon technology has enables the electronic industry to progress steadily over the past 50 years.It
is this technological stride that make computers to shrink in cost and
size .But a question still persists whether the present rate of
progress will continue for the next 50 years. The essential ingredient
to the progress had been the process of miniaturization.The
road to advances beyond a decade into the future has always been
obscure and has stimulated many speculations as to where
miniaturization must end. Th ....etc

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Title: FUNDAMENTAL LIMITS OF SILICON TECHNOLOGY
Page Link: FUNDAMENTAL LIMITS OF SILICON TECHNOLOGY -
Posted By: seminar projects crazy
Created at: Saturday 31st of January 2009 03:26:51 AM
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The rapid improvement in silicon technology has enables the electronic industry to progress steadily over the past 50 years. It is this technological stride that make computers to shrink in cost and size .But a question still persists whether the present rate of progress will continue for the next 50 years. The essential ingredient to the progress had been the process of miniaturization. The road to advances beyond a decade into the future has always been obscure and has stimulated many speculations as to where miniaturization must end. The pro ....etc

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Title: National Thermal Power Corporation technology
Page Link: National Thermal Power Corporation technology -
Posted By: seminar addict
Created at: Wednesday 25th of January 2012 04:14:26 PM
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National Thermal Power Corporation


Future Goals
The company has also set a serious goal of having 50000 MW of installed capacity by 2012 and 75000 MW by 2017. The company has taken many steps like step-up its recruitment, reviewing feasibilities of various sites for project implementations etc. and has been quite successful till date


Power Burden
India, as a developing country is characterised by increase in demand for electricity and as of momen ....etc

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Title: silicon oxide nitride oxide silicon
Page Link: silicon oxide nitride oxide silicon -
Posted By:
Created at: Friday 08th of March 2013 01:57:21 AM
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Title: nec corporation of 5 pen pc technology
Page Link: nec corporation of 5 pen pc technology -
Posted By:
Created at: Friday 24th of February 2012 03:58:34 AM
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Title: Silicon-Oxide-Nitride-Oxide-Silicon memmory SONOS
Page Link: Silicon-Oxide-Nitride-Oxide-Silicon memmory SONOS -
Posted By: project topics
Created at: Wednesday 27th of April 2011 01:47:37 PM
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A SONOS memory cell is formed from a standard polysilicon NMOS transistor with the addition of a small sliver of silicon nitride inserted inside the transistor's gate oxide. The sliver of nitride is non-conductive but contains a large number of charge trapping sites able to hold an electrostatic charge. The nitride layer is electrically isolated from the surrounding transistor, although charges stored on the nitride directly affect the conductivity of the underlying transistor channel. The oxide/nitride sandwich typically consists of a 2 nm thi ....etc

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