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Presented by:Rajesh M K
Reverse Engineering


Abstract
Cryptographic protocol is a precisely defined sequence of communication and computa¬tion steps that use cryptographic mechanisms such as message encryption and decryption. But even when strong encryption algorithms are used, information is not safe and flaws have been found in protocols considered to be secure. So it becomes necessary to verif ....etc

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i want full report on carbon chip or diamond chip
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INTRODUCTION!!!!!!
Engineering is the profession involved in designing, manufacturing, constructing, and maintaining of products, systems, and structures. At a higher level, there are two types of engineering: forward engineering and reverse engineering.
Forward engineering is the traditional process of moving from high-level abstractions and logical designs to the physical implementation of a system. It is the quotidian engineering of a product from a design
Reverse engineering is the process of starting with a finished product ....etc

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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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REVERSE ENGINEERING INVESTIGATING THE NANOSCALE

REVERSE ENGINEERING:
Product teardowns “ product, package, internal boards

System level analysis “ analyze operations, signal paths

Circuit extraction “ extract interconnections and components to create,delayer to transistor level

Process analysis “ examine the structure and materials
manufactured and what it is made of.


REVERSE ENGINEERING SPECIFICATION:

RE can cover objects from as large as a ....etc

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