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Title: CANOPEN
Page Link: CANOPEN -
Posted By: nikhilsj
Created at: Friday 05th of February 2010 03:22:33 PM
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Title: Clockless Chip
Page Link: Clockless Chip -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 12:17:15 PM
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Definition
Every action of the computer takes place in tiny steps, each a billionth of a second long. A simple transfer of data may take only one step; complex calculations may take many steps. All operations, however, must begin and end according to the clock's timing signals.

The use of a central clock also creates problems. As speeds have increased, distributing the timing signals has become more and more difficult. Present-day transistors can process data so quickly that they can accomplish several steps in the time that it takes a wir ....etc

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Title: Flip chip Technology
Page Link: Flip chip Technology -
Posted By: seminar projects crazy
Created at: Wednesday 28th of January 2009 04:06:30 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads. Flip chip is also called Direct Chip Attach (DCA), since the chip is directly attached to the substrate, board, or carrier by the conducti ....etc

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Title: Micromechanical System For System-On-Chip Connectivity
Page Link: Micromechanical System For System-On-Chip Connectivity -
Posted By: computer science crazy
Created at: Monday 22nd of September 2008 02:13:24 AM
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Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for p ....etc

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Title: CAnopen
Page Link: CAnopen -
Posted By: td_gujarat
Created at: Tuesday 28th of September 2010 02:57:44 PM
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Title: electronics and communication seminars topics
Page Link: electronics and communication seminars topics -
Posted By: project topics
Created at: Tuesday 20th of April 2010 05:47:22 PM
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2. Software,Hardware,Firmware Development In Embedded Systems
3. Component “Based and Distributed Web Application For Embedded Systems
4. Digital Image Processing III
5. Technical Paper on Redtacton
6. Introduction to GSM Network and its Application
7. An Embedded systems for Automated adaptive traffic signaling
8. Multiresolution watermark based on wavelet transform for digital images
9. Wimax in 4G communications
10. Removal of adherent water drops from images acquired wi ....etc

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Title: Go-Anywhere Chip
Page Link: Go-Anywhere Chip -
Posted By: computer science crazy
Created at: Tuesday 24th of February 2009 04:30:15 AM
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Qualcomm announced a new wireless chip. The company is calling this chip Gobi, coined from Go and Be, symbolic of travel, expedition and vast coverage, suggesting access anywhere and ultimate mobility. Even if you don't care for the name, the idea should appeal to you. You will be able to purchase a notebook computer with embedded wireless broadband (and a global positioning system, GPS), and no matter where you are in the world (with the exception of Japan, for now), you can turn it on, register on a network and have instant access to wireless ....etc

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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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Title: CAnopen
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Posted By: td_gujarat
Created at: Tuesday 28th of September 2010 02:57:44 PM
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Title: Electronics Communication Seminar Topic List
Page Link: Electronics Communication Seminar Topic List -
Posted By: computer science crazy
Created at: Monday 09th of November 2009 11:28:17 PM
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1. Double image mixing for D stereoscopic vision
2. Common Challenges in Image Processings
3. Radar guidance systems
4. Radio broadcasting system : Design and Application
5. Video Streaming Technology in G Mobile Communication Systems
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7. Wireless Video Service in CDMA Systems
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Title: CAnopen
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Posted By: td_gujarat
Created at: Tuesday 28th of September 2010 02:57:44 PM
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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: CANOPEN
Page Link: CANOPEN -
Posted By: nikhilsj
Created at: Friday 05th of February 2010 03:22:33 PM
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Title: CANOPEN
Page Link: CANOPEN -
Posted By: nikhilsj
Created at: Friday 05th of February 2010 03:22:33 PM
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Title: electronics and communication seminars topics
Page Link: electronics and communication seminars topics -
Posted By: project topics
Created at: Tuesday 20th of April 2010 05:47:22 PM
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1. Embedded Systems (Automation of cars)
2. Software,Hardware,Firmware Development In Embedded Systems
3. Component “Based and Distributed Web Application For Embedded Systems
4. Digital Image Processing III
5. Technical Paper on Redtacton
6. Introduction to GSM Network and its Application
7. An Embedded systems for Automated adaptive traffic signaling
8. Multiresolution watermark based on wavelet transform for digital images
9. Wimax in 4G communications
10. Removal of adherent water drops from images acquired wi ....etc

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Title: Electronics Communication Seminar Topic List
Page Link: Electronics Communication Seminar Topic List -
Posted By: computer science crazy
Created at: Monday 09th of November 2009 11:28:17 PM
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To get report and presentation of electronics communication seminar topic please browse through http://studentbank.in/topic-electronics-seminars-topics

1. Double image mixing for D stereoscopic vision
2. Common Challenges in Image Processings
3. Radar guidance systems
4. Radio broadcasting system : Design and Application
5. Video Streaming Technology in G Mobile Communication Systems
6. Edubuntu: Linux for Young Human Beings
7. Wireless Video Service in CDMA Systems
....etc

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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: three dimensional 3-D chip design download Report and ppt
Page Link: three dimensional 3-D chip design download Report and ppt -
Posted By: computer science crazy
Created at: Sunday 22nd of February 2009 02:39:50 AM
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1. INTRODUCTION

There is a saying in real estate; when land get expensive, multi-storied buildings are the alternative solution. We have a similar situation in the chip industry. For the past thirty years, chip designers have considered whether building integrated circuits multiple layers might create cheaper, more powerful chips.

Performance of deep-sub micrometer very large scale integrated (VLSI) circuits is being increasingly dominated by the interconnects due to increasing wire pitch and increasing die size. A ....etc

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Title: CANOPEN
Page Link: CANOPEN -
Posted By: nikhilsj
Created at: Friday 05th of February 2010 03:22:33 PM
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Title: CAnopen
Page Link: CAnopen -
Posted By: td_gujarat
Created at: Tuesday 28th of September 2010 02:57:44 PM
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