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Title: Nano copper wires interconnection for 3 dimensional integration in power electronics
Page Link: Nano copper wires interconnection for 3 dimensional integration in power electronics -
Posted By: 3e4r5t
Created at: Tuesday 27th of April 2010 05:51:24 AM
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How to present ppt for this topic given the following abstract

A process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy ....etc

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Title: copper tailing as plastering material
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Created at: Tuesday 10th of October 2017 01:46:15 AM
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Title: copper nanoparticle synthesis using plant extract
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Created at: Friday 21st of August 2015 06:43:28 PM
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Title: biological synthesis of copper nanoparticles using plant extract
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Created at: Wednesday 03rd of October 2012 07:29:57 PM
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BIOLOGICAL SYNTHESIS OF COPPER NANOPARTICLES
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Title: a study on preparation of bricks using copper tailing waste
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Posted By:
Created at: Tuesday 11th of December 2012 03:42:10 PM
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Title: studies on black cotton soil mixed copper mines waste
Page Link: studies on black cotton soil mixed copper mines waste -
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Created at: Thursday 03rd of January 2013 05:23:04 PM
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Title: copper nanoparticle synthesis using plant extract
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Created at: Friday 01st of February 2013 05:56:18 PM
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Title: Nano copper wires interconnection for three dimensional integration in power elect
Page Link: Nano copper wires interconnection for three dimensional integration in power elect -
Posted By: 3e4r5t
Created at: Tuesday 27th of April 2010 12:08:47 AM
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How to present ppt for this topic given the following abstract

A process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy ....etc

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Title: Ink-jetted SilverCopper conductors for printed RFID applications
Page Link: Ink-jetted SilverCopper conductors for printed RFID applications -
Posted By: computer science crazy
Created at: Wednesday 30th of September 2009 09:39:28 PM
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Low-resistance printed conductors crucial for the development of ultra-low cost electronic systems such as radio frequency identification tags. Low resistance conductors are required to enable the fabrication of high-Q inductors, capacitors, tuned circuits, and interconnect. Furthermore, conductors of appropriate work function are also required to enable fabrication of printed Schottky diodes, necessary for rectification in RFID circuits. Last year, we demonstrated the formation of low-resistance conductive printed structures using gold nano pa ....etc

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Title: soil stabilization using copper slag
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Created at: Tuesday 09th of October 2012 11:02:19 PM
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