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Title: Nano copper wires interconnection for 3 dimensional integration in power electronics
Page Link: Nano copper wires interconnection for 3 dimensional integration in power electronics -
Posted By: 3e4r5t
Created at: Tuesday 27th of April 2010 05:51:24 AM
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How to present ppt for this topic given the following abstract

A process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy ....etc

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Title: soil stabilization using copper slag
Page Link: soil stabilization using copper slag -
Posted By:
Created at: Tuesday 09th of October 2012 11:02:19 PM
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procedure for soil stabilization using copper slag
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Title: literature review on copper slag
Page Link: literature review on copper slag -
Posted By:
Created at: Tuesday 25th of December 2012 02:34:22 PM
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Title: copper slag concrete ppt
Page Link: copper slag concrete ppt -
Posted By:
Created at: Wednesday 24th of April 2013 06:52:52 PM
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Title: a study on preparation of bricks using copper tailing waste
Page Link: a study on preparation of bricks using copper tailing waste -
Posted By:
Created at: Tuesday 11th of December 2012 03:42:10 PM
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how we have to doing this project efficiently. ....etc

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Title: Nano copper wires interconnection for three dimensional integration in power elect
Page Link: Nano copper wires interconnection for three dimensional integration in power elect -
Posted By: 3e4r5t
Created at: Tuesday 27th of April 2010 12:08:47 AM
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How to present ppt for this topic given the following abstract

A process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to the permeation and the entanglement of the nanowires. This low temperature process allows saving energy ....etc

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Title: biological synthesis of copper nanoparticles using plant extract
Page Link: biological synthesis of copper nanoparticles using plant extract -
Posted By:
Created at: Wednesday 03rd of October 2012 07:29:57 PM
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biological synthesis of plant based copper nanoparticles
BIOLOGICAL SYNTHESIS OF COPPER NANOPARTICLES
BIOLOGICAL SYNTHESIS OF COPPER NANOPARTICLES ....etc

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Title: mechanical properties of sand replacement by copper slag ppt
Page Link: mechanical properties of sand replacement by copper slag ppt -
Posted By:
Created at: Thursday 20th of April 2017 12:04:34 AM
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I need ppt and seminar report on mechanical properties of Sand replacement by copper slag plzzz help me sir... ....etc

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Title: stabilization of black cotton soil by copper slag
Page Link: stabilization of black cotton soil by copper slag -
Posted By:
Created at: Sunday 26th of April 2015 08:17:04 PM
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i want ppt for stabilisation of black cotton soil with copper slag and cement ppt ....etc

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Title: Ink-jetted SilverCopper conductors for printed RFID applications
Page Link: Ink-jetted SilverCopper conductors for printed RFID applications -
Posted By: computer science crazy
Created at: Wednesday 30th of September 2009 09:39:28 PM
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Low-resistance printed conductors crucial for the development of ultra-low cost electronic systems such as radio frequency identification tags. Low resistance conductors are required to enable the fabrication of high-Q inductors, capacitors, tuned circuits, and interconnect. Furthermore, conductors of appropriate work function are also required to enable fabrication of printed Schottky diodes, necessary for rectification in RFID circuits. Last year, we demonstrated the formation of low-resistance conductive printed structures using gold nano pa ....etc

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