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Title: Web Development Various Data Interfacing Using PHP
Page Link: Web Development Various Data Interfacing Using PHP -
Posted By: project report helper
Created at: Tuesday 26th of October 2010 07:30:59 PM
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Web Development & Various Data Interfacing Using PHP

By

Prajakta Shantaram Bhagwat
Department of Information Technology
The Shirpur Education Society’s
R. C. Patel Institute of Technology
Shirpur - 425405.



ABSTRACT


Advances in information technology have provided educators with the tools needed to present abstract concepts in a clear and concise manner. The report contains History of web development and various data interfacing using php. Web development and interfacing using php ....etc

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Title: An Introduction to Various Multiplication Strategies
Page Link: An Introduction to Various Multiplication Strategies -
Posted By: computer girl
Created at: Tuesday 05th of June 2012 03:46:16 PM
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An Introduction to Various Multiplication Strategies



Multiplication is one of the four basic operations of elementary arithmetic and is commonly defined as repeated addition. However, while this definition applies to whole number multiplication, some math researchers argue that it falls short for multiplication of fractions and other kinds of numbers. These mathematicians prefer to define multiplication as the scaling of one number by another, or as the process by which the product of two numbers is computed (Princ ....etc

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Title: To create a distributed application to download various files from various servers us
Page Link: To create a distributed application to download various files from various servers us -
Posted By: smart paper boy
Created at: Tuesday 19th of July 2011 07:29:34 PM
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Aim: To create a distributed application to download various files from various servers using RMI
Algorithm:
1. Create four files – file interface, file implementation, file client and fileserver
2. In the file interface, class specify the prototype of the method that is to be implemented in the file implementation class
3. In the file implementation class, specify the implementation coding for the method defined earlier (download file)
4. Try to read the contents of a file in this class
5. In the fileclient class try t ....etc

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Title: The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasiv
Page Link: The effect of hydrogen peroxide on polishing removal rate in CMP with various abrasiv -
Posted By: computer science crazy
Created at: Monday 29th of September 2008 01:12:34 PM
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Chemical Mechanical Planarization (CMP) is an important process in semiconductor chip fabrication. In the CMP process, excess material is removed and the surface is planarized by the action of chemical and mechanical forces. Shallow Trench Isolation (STI) has become a key technology for device isolation in recent times. In this method, a shallow trench is made on the silicon wafer between active devices, silicon dioxide is deposited over the trench as well as the active area and the excess silicon dioxide is removed by CMP. The oxide remaining ....etc

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Title: Analysis and Simulation of the Various Generators Used in Wind Systems
Page Link: Analysis and Simulation of the Various Generators Used in Wind Systems -
Posted By: seminar presentation
Created at: Tuesday 18th of May 2010 11:56:20 PM
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Authors:
L. Abdelhamid
H. Amimeur
L. Bahmed
Abstract:
The world ....etc

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Title: introduction to diamond chip
Page Link: introduction to diamond chip -
Posted By:
Created at: Monday 04th of March 2013 10:46:11 PM
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Title: diamond chip o carbon chip
Page Link: diamond chip o carbon chip -
Posted By: vijay kumarkm
Created at: Wednesday 03rd of March 2010 02:20:19 PM
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Electronics without silicon is unbelievable, but it will come true with the evolution of Diamond or Carbon chip. Now a day we are using silicon for the manufacturing of Electronic Chip's. It has many disadvantages when it is used in power electronic applications, such as bulk in size, slow operating speed etc. Carbon, Silicon and Germanium are belonging to the same group in the periodic table. They have four valance electrons in their outer shell. Pure Silicon and Germanium are semiconductors in normal temperature. So in the earlier days they a ....etc

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Title: Flip chip or Direct Chip Attach DCA
Page Link: Flip chip or Direct Chip Attach DCA -
Posted By: Electrical Fan
Created at: Saturday 14th of November 2009 07:31:59 PM
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In the development of packaging of electronics the aim is to lower cost, increase the packaging density, and improve the performance while still maintaining or even improving the reliability of the circuits. Flip chip microelectronic assembly is the direct electrical connection of face-down electronic components onto substrates, circuit boards, or carriers, by means of conductive bumps on the chip bond pads since the chip is directly attached to the substrate, board, or carrier by the conductive bumps. Flip chip has advantage in size, performan ....etc

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Title: evaluation of first swing stability of a large power system with various facts device
Page Link: evaluation of first swing stability of a large power system with various facts device -
Posted By: devanaik
Created at: Saturday 20th of March 2010 08:38:57 PM
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Title: carbon chip or diamond chip
Page Link: carbon chip or diamond chip -
Posted By: sprity
Created at: Sunday 28th of February 2010 01:08:58 PM
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